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Hot melt pressure sensitive adhesive composition with improved rheological properties

一种粘合剂、组合物的技术,应用在粘结基材,热熔压敏粘合剂领域,能够解决粘合剂丧失结构完整性、粘合剂粘结韧性降低、粘合剂粘结失效等问题,达到高粘结强度、良好高温耐热性、低气味的效果

Active Publication Date: 2021-11-23
SIKA TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

at below T g temperature, the adhesive material becomes brittle and the toughness of the adhesive bond decreases
At temperatures above the intersection point, the adhesive loses its structural integrity, which can eventually lead to adhesive bond failure

Method used

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  • Hot melt pressure sensitive adhesive composition with improved rheological properties
  • Hot melt pressure sensitive adhesive composition with improved rheological properties

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0084] The compounds and products shown below in Table 1 were used in the examples.

[0085] Table 1

[0086]

[0087] Preparation of Adhesive Composition

[0088] For each adhesive composition, the ingredients shown in Table 1 were mixed in a Sigma kneader at a temperature of 180°C. The preparation process begins by mixing the styrenic block copolymer, a small portion of the resin and additives. The first mixing step was in CO 2 - Under atmosphere and for 45 minutes, then add the rest of the resin and continue mixing under vacuum for 30 minutes.

[0089] The liquid polyisobutylene was then added to the mixture and mixing was continued for an additional 30 minutes under vacuum. The adhesive compositions were stored in siliconized boxes for one day before being used to characterize their properties.

[0090] Viscosity at 190°C

[0091] Viscosity was measured using a Brookfield DV-2 Thermosel viscometer with a No. 27 spindle at a temperature of 190°C at 10 revolution...

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PUM

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Abstract

The present invention relates to an adhesive composition comprising at least one first styrene-isoprene-styrene block copolymer having a diblock content of not less than 45%, at least one first styrene-isoprene-styrene block copolymer having a diblock content of not more than 30% by weight a second styrene-isoprene-styrene block copolymer having a styrene content of 100°C or greater, at least one first tackifying resin having a softening point equal to or greater than 100°C and at least one tackifying resin having a softening point equal to or greater than 120°C Softening point of the second tackifying resin. The invention also relates to methods of bonding substrates together using the adhesive composition.

Description

technical field [0001] The present invention relates to an adhesive composition, especially a hot-melt pressure-sensitive adhesive and its use for bonding substrates. [0002] Background of the invention [0003] Hot melt adhesives are one-component, water- and solvent-free adhesives that are solid at room temperature. These adhesives are applied in the form of a melt, and the adhesive bond is established by cooling and setting. Due to the relatively short open times, the substrates to be bonded are often assembled immediately or after a few minutes after application of the adhesive melt. In some applications, the waiting time, i.e. the period of time between applying the adhesive to the surface of the first substrate and bringing the adhesive film into contact with the second substrate, is relatively long and the bond must be made hot. The agent layer is reactivated. Typically, the adhesive-coated first substrate is cooled and stored for a more or less extended period of ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J153/02C09J7/35C09J7/38C09J123/00C09J123/26C09J5/00
CPCC09J123/26C09J153/02C08L2205/025C08L2205/035C08L101/00C08L23/26C08L23/20C08L23/02C08L53/02C08L25/00C09J7/387C08F240/00C09J2203/00
Inventor D·尤丁J·R·维拉费雷拉T·汉霍斯特
Owner SIKA TECH AG
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