Preparation method of high-thermal-conductivity bonding sheet special for aluminium-based copper-clad plate

Abstract

The invention discloses a preparation method of a high-thermal-conductivity bonding sheet special for an aluminium-based copper-clad plate. The preparation method comprises the steps that glue is prepared, a glass fiber cloth is paved, the position of a containing box is adjusted, the glue is applied, and the high-thermal-conductivity bonding sheet is prepared by being bake-dried to be a semi-curing state. According to the preparation method, the thermal conductivity of the bonding sheet is improved, the toughness of the bonding sheet is also improved, meanwhile aluminum oxide powder is addedin the preparation process of the bonding sheet, and is uniformly distributed in pores between aluminum oxide fibers, thus the thermal conductivity of the prepared bonding sheet is maximized, the preparation raw materials of the bonding sheet is safe and non-toxic, and the safety of workers is ensured; under the conditions of pressing and heating, the glue can be quickly permeated into gaps of glass fibers, the gaps of the glass fibers are filled, air in the glass fibers is exhausted, thus the thermal conductivity of the bonding sheet is improved, and the glue is saved by adopting a mode of extruding and applying.

Description

technical field [0001] The invention relates to the technical field of composite boards, in particular to a method for preparing a special high-thermal-conduction bonding sheet for aluminum-based copper-clad boards. Background technique [0002] As the development of electronic products tends to be multi-functional, the components of electronic products are also constantly developing in light, thin, short, small, etc., especially the wide application of high-density integrated circuit technology, which proposes high-performance, Requirements for high reliability and high security; requirements for good technical performance, low cost, and low energy consumption for industrial electronic products. Therefore, the base material copper-clad laminate of the printed circuit board, which is the core material of electronic products, faces higher technical requirements, more severe use environment and higher environmental protection requirements; It is a plate-shaped material made o...

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Problems solved by technology

[0004] The purpose of the present invention is to provide a method for preparing a special high thermal conductivity adhesive sheet for aluminum-based copper-clad laminates. Alumina fibers are added in the preparation process of the adhesive sheet, which not only improves the thermal conductivity of the adhesive sheet, but also increases the viscosity of the adhesive sheet. At the same time, alumina powder is added in the preparation process of the bonded sheet, so that the alumina powder is evenly distributed in the pores between the alumina fibers, so that the thermal conductivity of the prepared bonded sheet can be maximized. The raw materials for the preparation of the adhesive sheet are safe and non-toxic, which ensures the safety of the staff, and solves the technical problems that the raw materials are harmful to the human body and the thermal conductivity of the adhesive sheet is poor in the existing preparation method of the adhesive sheet;

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