Method for preparing N-type crystalline silicon battery
A technology for crystalline silicon cells and crystalline silicon wafers, applied in the field of solar cells, can solve problems such as leakage, and achieve the effects of solving edge leakage, reducing reverse voltage leakage, and simple preparation method
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[0053] figure 1 Shown is an N-type crystalline silicon battery prepared in this example, including a front metal electrode 1, a SiNx layer 2, an AlOx layer 3, a boron-doped layer 4, an N-type silicon base layer 5, and a SiO 2 Layer 6, Polysilicon layer 7, SiNx layer 8 and back metal electrode 9, wherein SiNx layer 2, AlOx layer 3, boron doped layer 4, N-type silicon base layer 5, SiO 2 Layer 6, Polysilicon layer 7 and SiNx layer 8 are stacked sequentially from top to bottom, the front metal electrode 1 passes through the SiNx layer 2 and AlOx layer 3 to form an ohmic contact with the boron doped layer 4, and the back metal electrode 9 passes through the SiNx layer 8 to form an ohmic contact with the Polysilicon layer 7.
[0054] The following steps are used to prepare as figure 1 For the N-type crystalline silicon battery shown, prepare a group of N-type single-crystal silicon wafers (50 pieces) and do the following:
[0055] (1) N-type crystal silicon chip is carried out t...
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