Technique for BOE corrosion

Abstract

The invention discloses a technique for BOE corrosion. The technique comprises the following steps: enabling a silicon wafer to move up and down in acid liquor to reduce bubble quantity clung to the silicon wafer in the corrosion process in the etching process of photoetching technology, entirely taking out the a rack from the liquid surface for 1S so that the bubbles clung to the silicon wafer are easy to break through the quick change of the pressure, and finally the silicon wafer is placed in the acid liquor to continuously move up and down for circular corrosion for 12min, thereby realizing the corrosion on the silicon wafer. The silicon wafer is corroded through a BOE corrosion trough, so that the corrosion liquor can circularly flow to maintain the consistent concentration of the corrosion liquor at various locations in the trough in the corrosion process; and meanwhile, the flowing corrosion liquor can completely or mostly remove the bubbles clung to the silicon wafer, the silicon wafer corrosion consistency is improved, and the influence on the corrosion effect by the bubbles produced in the corrosion process is reduced.

Description

technical field [0001] The invention belongs to the technical field of semiconductors, and in particular relates to a process method for BOE corrosion. Background technique [0002] The active area is the area where active devices are made on the silicon wafer. Photolithography is a major process in the production of planar transistors and integrated circuits. Photolithography mainly includes surface cleaning and drying, bottom coating, spin coating photoresist, soft baking , Alignment exposure, post-baking, developing, hard-baking, etching, testing and other processes, a wet etching commonly used in etching is BOE etching, BOE etching has many advantages over dry etching, such as low equipment cost, Low single chip cost, high production efficiency, etc. Under the existing technology, BOE corrosion also has many deficiencies, such as unstable corrosion rate, partial corrosion of products, staining of some areas, large deviation of line width and size after corrosion, etc. ...

AI Technical Summary

Problems solved by technology

Ultrasonic waves and acid solution bubbling are usually introduced into the tank, which increases the equipment cost, but the corrosion effect is still unsatisfactory. In order to solve this problem, the present invention provides the following technical solutions

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