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A kind of emc packaging silica gel and application

A technology of silica gel and organosiloxane, applied in the direction of adhesives, etc., can solve the problems of restricting the use of EMC brackets, poor adhesion, and easy peeling

Active Publication Date: 2021-11-12
东莞市贝特利新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, under the existing technical conditions, there are disadvantages such as poor adhesion between addition-type silicone rubber and EMC devices, and easy peeling, which greatly limits the use of EMC brackets.

Method used

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  • A kind of emc packaging silica gel and application
  • A kind of emc packaging silica gel and application

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0079] The present invention has no special limitation on the preparation method of the EMC encapsulating silica gel, which can be obtained by mixing the above raw materials.

[0080] The present invention also provides the application of a kind of EMC encapsulation silica gel in encapsulation EMC support, and described EMC encapsulation silica gel is EMC encapsulation silica gel described above, the present invention injects EMC encapsulation silica gel in the above EMC support, in 70~ Heating at 80°C for 1 to 2 hours, and then heating at 150 to 160°C for 3 to 4 hours can realize the packaging of the EMC bracket.

[0081] The invention provides an EMC encapsulating silica gel, which is made of the following components in parts by weight: organosiloxane A: 1-10 parts; organosiloxane B: 0.1-1 part; organosiloxane C: 2 parts ~6 parts; Custer catalyst: 0.01~0.1 part; Inhibitor: 0.01~0.08 part; Tackifier: 0.05~0.5 part; The organosiloxane A has the chemical formula shown in formul...

Synthetic example 1-1

[0083] Synthesis example 1-1 Synthesis of organosiloxane A-1

[0084]Place 111.84g of 1,3-divinyl-1,1,3,3-tetramethyldisiloxane, 1130.4g of toluene, 473.4g of water, 30g of concentrated sulfuric acid in a reaction vessel, and A mixed solution of 191.73 g of methylvinyldimethoxysilane, 1189.74 g of phenyltrimethoxysilane, and 281.13 g of ethyl orthosilicate was added dropwise at a temperature of °C or lower. After completion of the dropwise addition, the obtained mixture was stirred at 75° C. for 2 hours. Then it was cooled to room temperature, 692.8 g of toluene was added, and the acid was washed away with water.

[0085] The solvent was removed under reduced pressure to obtain an organopolysiloxane resin represented by the following average unit formula:

[0086] (Me 2 ViSiO 0.5 ) 0.12 (MeViSiO) 0.145 (PhSiO 1.5 ) 0.6 (SiO 2 ) 0.135 (OMe) 0.01 (OH) 0.01 ;

Synthetic example 1-2

[0087] Synthesis example 1-2 Synthesis of organosiloxane A-2

[0088] 139.8g of 1,3-divinyl-1,1,3,3-tetramethyldisiloxane, 1090.7g of toluene, 441g of water, 29g of concentrated sulfuric acid were placed in a reaction vessel, and at 30°C A mixed solution of 132.23 g of methylvinyldimethoxysilane and 1487.18 g of phenyltrimethoxysilane was added dropwise at or lower temperature. After completion of the dropwise addition, the obtained mixture was stirred at 75° C. for 3 hours. Then it was cooled to room temperature, 668.5 g of toluene was added, and the acid was washed with water.

[0089] The solvent was removed under reduced pressure to obtain an organopolysiloxane resin represented by the following average unit formula:

[0090] (Me 2 ViSiO 0.5 ) 0.15 (MeViSiO) 0.1 (PhSiO 1.5 ) 0.75

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Abstract

The invention provides an EMC encapsulating silica gel, which is made of the following components in parts by weight: organosiloxane A: 1-10 parts; organosiloxane B: 0.1-1 part; organosiloxane C: 2 parts ~6 parts; Custer catalyst: 0.01~0.1 part; Inhibitor: 0.01~0.08 part; Tackifier: 0.05~0.5 part; The organosiloxane A has the chemical formula shown in formula I: (Me 2 ViSiO 0.5 ) a (MeViSiO) b (PhSiO 1.5 ) c (SiO 2 ) d (OMe) e (OH) f Formula I; wherein 0.01≤a≤0.5; 0≤b≤0.7; 0≤c≤0.9; 0≤d≤0.9, and a+b+c+d=1; and 0.001≤e≤0.1; 0.001≤f≤ 0.1; the organosiloxane B has the chemical formula shown in formula II: (Me 2 ViSiO 0.5 ) m (MePhSiO) n Formula II; wherein 0.01≤m≤5; 1≤n≤50; the organosiloxane C has the chemical formula shown in formula III: (HMe 2 SiO 0.5 ) h (MePhSiO) j Formula III; wherein 0.01≤h≤5; 1≤j≤50. The present invention is in the synthesis containing SiO 2 In the special polysiloxane process of chain link and MeViSiO chain link, hydroxyl group and methoxyl group are reserved by designing and synthesizing to promote the bonding with EMC support and improve the bonding performance of silica gel and EMC support in the present invention.

Description

technical field [0001] The invention belongs to the technical field of organic silicon materials, and in particular relates to an EMC packaging silica gel and its application. Background technique [0002] EMC (epoxy molding compound) has excellent properties such as high reliability, high thermal conductivity, high heat and humidity resistance, low stress, and low expansion coefficient, and is very suitable for LED packaging devices. LED EMC bracket is a highly integrated bracket, known as the third-generation LED bracket; compared with the first-generation PPA pre-molded frame and the second-generation ceramic substrate, EMC bracket can achieve mass production and reduce costs , design flexibility, smaller size and other advantages. Addition-type liquid silicone rubber has the advantages of no by-products in the reaction process, small shrinkage rate, and deep vulcanization. It also has the characteristics of high light transmittance, good thermal stability, and excellent...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J183/07C09J183/04
CPCC08L2203/206C08L2205/025C08L2205/035C09J183/04C08L83/04
Inventor 刘圣兵侯海鹏汤胜山袁允达
Owner 东莞市贝特利新材料有限公司
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