A kind of emc packaging silica gel and application

A technology of silica gel and organosiloxane, applied in the direction of adhesives, etc., can solve the problems of restricting the use of EMC brackets, poor adhesion, and easy peeling
CN110607163BActive Publication Date: 2021-11-12东莞市贝特利新材料有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
东莞市贝特利新材料有限公司
Publication Date
2021-11-12

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Abstract

The invention provides an EMC encapsulating silica gel, which is made of the following components in parts by weight: organosiloxane A: 1-10 parts; organosiloxane B: 0.1-1 part; organosiloxane C: 2 parts ~6 parts; Custer catalyst: 0.01~0.1 part; Inhibitor: 0.01~0.08 part; Tackifier: 0.05~0.5 part; The organosiloxane A has the chemical formula shown in formula I: (Me 2 ViSiO 0.5 ) a (MeViSiO) b (PhSiO 1.5 ) c (SiO 2 ) d (OMe) e (OH) f Formula I; wherein 0.01≤a≤0.5; 0≤b≤0.7; 0≤c≤0.9; 0≤d≤0.9, and a+b+c+d=1; and 0.001≤e≤0.1; 0.001≤f≤ 0.1; the organosiloxane B has the chemical formula shown in formula II: (Me 2 ViSiO 0.5 ) m (MePhSiO) n Formula II; wherein 0.01≤m≤5; 1≤n≤50; the organosiloxane C has the chemical formula shown in formula III: (HMe 2 SiO 0.5 ) h (MePhSiO) j Formula III; wherein 0.01≤h≤5; 1≤j≤50. The present invention is in the synthesis containing SiO 2 In the special polysiloxane process of chain link and MeViSiO chain link, hydroxyl group and methoxyl group are reserved by designing and synthesizing to promote the bonding with EMC support and improve the bonding performance of silica gel and EMC support in the present invention.
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Description

technical field

[0001] The invention belongs to the technical field of organic silicon materials, and in particular relates to an EMC packaging silica gel and its application. Background technique

[0002] EMC (epoxy molding compound) has excellent properties such as high reliability, high thermal conductivity, high heat and humidity resistance, low stress, and low expansion coefficient, and is very suitable for LED packaging devices. LED EMC bracket is a highly integrated bracket, known as the third-generation LED bracket; compared with the first-generation PPA pre-molded frame and the second-generation ceramic substrate, EMC bracket can achieve mass production and reduce costs , design flexibility, smaller size and other advantages. Addition-type liquid silicone rubber has the advantages of no by-products in the reaction process, small shrinkage rate, and deep vulcanization. It also has the characteristics of high light transmittance, good thermal stability, and excellent...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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