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Integrated Circuit Packaging Equipment

A technology for packaging equipment and integrated circuits, applied in the manufacturing of circuits, electrical components, semiconductor/solid-state devices, etc., can solve the problems of long construction period, high cost of small batch packaging, large investment in integrated circuit packaging, etc., and achieves a reduction in investment and construction period. Effect

Active Publication Date: 2021-12-21
HOSIN GLOBAL ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is to provide an integrated circuit packaging equipment for the above-mentioned problems of large investment, long construction period, and high cost of small-batch packaging of integrated circuits

Method used

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  • Integrated Circuit Packaging Equipment
  • Integrated Circuit Packaging Equipment
  • Integrated Circuit Packaging Equipment

Examples

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Embodiment Construction

[0028] The following disclosure provides many different embodiments, or examples, for implementing different features of the presented subject matter. Specific examples of components, values, operations, materials, arrangements, etc. are set forth below to simplify embodiments of the invention. Of course, these are examples only and are not intended to be limiting. Other components, values, operations, materials, arrangements, etc. are contemplated. For example, the description below that a first feature is formed "over" or "on" a second feature may include embodiments where the first and second features are formed in direct contact, and may also include embodiments where the first feature is formed in direct contact. Embodiments where an additional feature may be formed between a feature and a second feature such that the first feature may not be in direct contact with the second feature. In addition, the embodiments of the present invention may reuse reference numerals and...

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Abstract

The present invention provides an integrated circuit packaging device, which includes a closed chamber and a control device, and a first printing assembly, a die mounting assembly, a second printing assembly, and a material transfer assembly are arranged in the airtight chamber, and the The first printing assembly, the die mounting assembly, the second printing assembly and the material transfer assembly operate under the control of the control device; the first printing assembly is used to form a packaging substrate; the die mounting assembly is used to place The grain to be packaged is pasted and fixed to the packaging substrate in such a way that the active surface faces the packaging substrate; the second printing component is used to sequentially form a plurality of stacked and insulated first Two light-curable adhesive layers; the material transfer component is used for material transfer between the first printing component, the chip mounting component and the second printing component. The invention can greatly reduce the investment and construction period of integrated circuit packaging, and is especially suitable for small-batch integrated circuit packaging.

Description

technical field [0001] The invention relates to the field of integrated circuit packaging, and more specifically relates to an integrated circuit packaging device. Background technique [0002] Modern products are thin, light and small, so many discrete circuits are integrated into integrated circuits. At present, integrated circuits have been widely used in personal computers, mobile phones, digital cameras, and other electronic devices. In order to provide a stable and reliable working environment for the integrated circuit, and to protect the integrated circuit mechanically or environmentally, so that the integrated circuit can perform normal functions and ensure its high stability and reliability, it is necessary to package the integrated circuit . [0003] Integrated circuit packaging refers to the use of film technology and micro-connection technology to arrange, paste, fix and connect integrated circuits and other elements on the lead frame (Lead Frame) or substrate...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
CPCH01L21/67121H01L21/6715
Inventor 赖振楠
Owner HOSIN GLOBAL ELECTRONICS CO LTD
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