Method for manufacturing PCB circuit pattern

Abstract

The embodiment of the invention discloses a method for manufacturing a PCB circuit pattern. The method comprises the steps that 1 PTH copper plating / complete electroplating is carried out on a PCB tobe processed; 2 complete tinning is carried out on the PCB after copper plating; 3 a laser etching technology is used to directly engrave the circuit pattern on the tin surface of the tinned PCB, andtin in the non-circuit pattern area on the PCB surface is etched away; 4 a PCB chemical etching machine is used to etch away the copper surface which is not covered by tin on the engraved PCB; and 5 tin remaining on the etched PCB is de-tinned with a de-soldering solution to complete the circuit pattern production of the PCB. According to the embodiment of the invention, the copper circuit patternis acquired by sequentially performing copper plating, tin plating, laser engraving, pattern etching and de-tinning on the PCB, which solves the problem of complicated and demanding circuit pattern production; the production process is simplified; the cost is reduced; and the yield of the PCB product is improved.

Description

technical field [0001] The invention relates to the technical field of PCB board processing, in particular to a method for making circuit patterns of a PCB board. Background technique [0002] The traditional circuit graphics production process is to press a layer of photosensitive dry film on the board surface after PTH copper sinking / full board electroplating, and use the principle of image transfer to transfer the circuit graphics to the photosensitive dry film, and then develop it through a dry film developing machine. The unnecessary dry film leaves the circuit pattern, and then performs pattern electroplating and pattern etching / sn stripping, so as to obtain the outer circuit pattern. [0003] However, the traditional line graphics production has the following disadvantages: [0004] 1) The traditional circuit graphics production process has very high requirements on the cleanliness of the operating environment and equipment. The operations of dry film pressing and im...

AI Technical Summary

Problems solved by technology

[0004] 1) The traditional circuit graphics production process has very high requirements on the cleanliness of the operating environment and equipment. The operations of dry film pressing and image transfer exposure need to be produced in a dust-free workshop with temperature and humidity control. During the process of pressing dry film and image transfer If dust, garbage and other debris are mixed into the dry film, board surface or operating equipment, it will cause defects in the outer layer of the circuit.

[0005] 2) During the operation, there will be abnormalities such as wrinkling of the laminated film, poor exposure, broken back sticking, and endless development, which will increase the occurrence of defective products in the process of PCB product production

Various operating equipment such as: pre-processing machine, laminating machine, exposure machine, photoplotter, developing machine, etc. increase the input cost of the factory

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