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Electrolysis deplating solution and method for removing copper layer and tin layer on hanging tool simultaneously

A technology for deplating solution and copper layer, which is applied in the direction of electrolytic process and electrolytic components, etc. It can solve the problems of easy damage to the substrate, long deplating time of chemical deplating method, poor deplating effect, etc., and achieves efficient deplating, Improve the effect of deplating and reduce the effect of deplating time

Active Publication Date: 2019-12-31
深圳市祺鑫环保科技有限公司
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Problems solved by technology

Among them, the chemical deplating method has a long deplating time, poor deplating effect, easy to damage the substrate, and is accompanied by a large amount of waste water, which pollutes the environment; and the existing electrolytic deplating method cannot realize copper plating on the hanger. At the same time as the removal of the copper coating and / or the tin coating, the efficient recycling of the copper coating and / or the tin coating on the hanger is also achieved, and it is also accompanied by the corrosion of the base material, resulting in a large amount of waste water

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  • Electrolysis deplating solution and method for removing copper layer and tin layer on hanging tool simultaneously
  • Electrolysis deplating solution and method for removing copper layer and tin layer on hanging tool simultaneously
  • Electrolysis deplating solution and method for removing copper layer and tin layer on hanging tool simultaneously

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Embodiment Construction

[0024] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with specific embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative work all belong to the protection scope of the present invention.

[0025] With the continuous advancement of science and technology, electronic products are also constantly changing, and the PCB board, which is the carrier of the electrical connection of electronic components, is also constantly being updated. However, in the PCB electroplating process, due to the tip effect of the current, very thick copper plating and / or tin plating will be formed on the conductive part of the stainless steel hanger, which brings great inconvenien...

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Abstract

The invention discloses an electrolysis deplating solution and a method for removing a copper layer and a tin layer on a hanging tool simultaneously. The electrolysis deplating solution comprises nitrate, sulfuric acid, an accelerant, a copper corrosion inhibitor, hexamethylenetetramine, urea and glycerinum, and the solvent is water. Through the electrolysis deplating solution, the copper coatingand / or the tin coating on the hanging tool can be recovered efficiently while the copper coating and / or the tin coating on the hanging tool are / is removed efficiently.

Description

technical field [0001] The invention relates to the technical field of metal surface treatment and electrolytic deplating, in particular to an electrolytic deplating solution and a method for simultaneously removing a copper layer and a tin layer on a hanger. Background technique [0002] With the rapid development of science and technology, people's demand for electronic products is also increasing. Among them, the printed circuit board (abbreviated as PCB board in English), as the carrier of electronic components, is an important electronic component. During the electroplating process of the PCB board, due to the tip effect of the current, a very thick copper plating layer and / or tin plating layer will be formed on the conductive part of the rack. Before using the rack again, the plating on the rack needs to be removed before reuse. [0003] In the prior art, the methods for deplating treatment on the surface of the hanger mainly contain chemical deplating and electrolyti...

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Application Information

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IPC IPC(8): C25F3/02C25F7/02
CPCC25F3/02C25F7/02
Inventor 汪前程黄文涛梁民
Owner 深圳市祺鑫环保科技有限公司
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