Electrolysis deplating solution and method for removing copper layer and tin layer on hanging tool simultaneously
A technology for deplating solution and copper layer, which is applied in the direction of electrolytic process and electrolytic components, etc. It can solve the problems of easy damage to the substrate, long deplating time of chemical deplating method, poor deplating effect, etc., and achieves efficient deplating, Improve the effect of deplating and reduce the effect of deplating time
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[0024] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with specific embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.
[0025] With the continuous advancement of science and technology, electronic products are constantly changing, and the PCB board as the carrier of the electrical connection of electronic components is also constantly updated. However, in the PCB electroplating process, due to the sharp effect of the current, the conductive part of the stainless steel hanger will form a thick copper and / or tin coating, which brings great inconvenience to the electroplating of the...
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