Miniled backlight substrate packaging method

Abstract

A miniled backlight substrate packaging method comprises the following steps: the step of material preparation: preparing a double-sided copper-clad plate, wherein the thickness of the double-sided copper-clad plate is 100-1000 micrometers, the thickness of a single layer of copper foil being 12-35 micrometers; the step of drilling: drilling the double-sided copper-clad plate to ensure that drilled holes run through two layers of copper foils of the double-sided copper-clad plate; the step of copper plating: plating copper on the walls of the drilled holes of the double-sided copper-clad plateto make the copper plating layers on the walls of the drilled holes connected with the copper foils on the two sides of the double-sided copper-clad plate to allow the copper foils on the two sides of the double-sided copper-clad plate to be electrically connected; and the step of hole filling: filling the drilled holes with white resin or white ink. The white resin used in the anisotropic conductive adhesive manufacturing step is melted, and the side faces of a miniled chip is wrapped due to surface tension, so that the chip is independently wrapped, a reflection cup is formed, and the reflection brightness of light is improved.

Description

technical field [0001] The invention relates to a miniled backlight substrate packaging method. Background technique [0002] The specifications of flip chips are getting smaller and smaller, and the gap between positive and negative electrodes is as small as 20 μm. At present, the minimum gap of ordinary silver paste or tin paste can only realize the placement with a gap of 50 μm between the positive and negative electrodes, and it is very difficult, which may easily cause a micro-short circuit between the positive and negative electrodes. [0003] The number of Miniled backlight substrate chips is huge. For the traditional silver paste and solder paste process, during production, due to the long time of solid crystal, the solvent of the paste is easy to volatilize, resulting in the failure of placement. [0004] In addition, the brightness loss of the backlight substrate in the prior art is large, and there is a problem of light diffraction, which cannot block light and a...

AI Technical Summary

Problems solved by technology

At present, the minimum gap of ordinary silver paste or tin paste can only achieve the placement with a positive and negative gap of 50 μm, and it is very difficult, which may easily cause a micro-short circuit between the positive and negative electrodes

[0003] The number of Miniled backlight substrate chips is huge. For the traditional silver paste and solder paste process, during production, due to the long time of solid crystal, the solvent of the paste is easy to volatilize, resulting in the failure of placement

[0004] In addition, the brightness loss of the backlight substrate in the prior art is very large, and there is a problem of light diffraction, which cannot block light, which affects the visual experience

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