76results about How to "Avoid bond failure" patented technology

A lighting device (11) especially a semiconductor lighting device is provided. The lighting device may include at least one first part (12) and at least one second part (13), fastened to the first part (12), wherein the first and second parts are interconnected by a potting compound (21) especially a cured adhesive, the parts being positively interconnected by the potting compound (21).

Aiming at adjusting the height of bump electrodes connected to lands on a substrate, a semiconductor device 100 has a first interconnect substrate 103 and a second interconnect substrate 101. On one surface of these substrates, first lands 111 and second lands 113 are provided. The plane geometry of the second lands 113 is a polygon characterized by the inscribed circle thereof having an area smaller than the area of the inscribed circle of the first land.

A semiconductor package that includes a package substrate, a lower semiconductor chip mounted on the package substrate, and an upper semiconductor chip stacked on the lower semiconductor chip in a cascade shape is provided. An active surface of the lower semiconductor chip is facing an active surface of the upper semiconductor chip.

A manufacturing method for a semiconductor light emitting device is provided. The method includes preparing a first wafer in which at least one semiconductor layer including the emitter layer is formed; disposing a second wafer transparent to an emission wavelength of the emitter layer on the surface of the first wafer; providing a bonding failure prevention structure to at least either the first wafer or the second wafer for preventing bonding failures of the first wafer and the second wafer; and applying compressive force to a contact face between the first wafer and the second wafer while at the same time, heating the contact face. The first and second wafers can be bonded across their entire surfaces without causing bonding failure.

Disclosed are a curved display manufacturing apparatus, comprising: a curved surface suction mold comprising a panel seat surface having a curved shape corresponding to a curved shape of the curved display to be formed, and air sucking holes formed through the panel seat surface; an air sucking unit for sucking air through the air sucking holes; a main frame for supporting the curved surface suction mold, to space the curved surface suction mold from a bottom of the main frame; and a pressing roller unit for pressing a curvature maintaining member to maintain the display panel in a bent state while sliding along a curved surface of the display panel under a condition that the curvature maintaining member overlaps with the display panel, for pressed attachment of the curvature maintaining member to the display panel.

A printed circuit board provided with board electrodes, wherein each board electrode is provided with a board electrode base, for carrying by soldering a bottom electrode arranged at a bottom of an electronic device inside from outer edges of the electronic device, arranged inside from the outer edges of the electronic device and a projection projecting out from the board electrode base, narrower in width than the board electrode base, and connected to an interconnect of the printed circuit board.

A method for bonding metallic plates includes: sandwiching a laminated body, which includes a plurality of metallic plates and is formed with an inner cavity opening on a surface thereof, between a pair of jigs each having a flat abutment surface abutting against respective surfaces of the laminated body, wherein at least one of the jigs is formed with an atmosphere communication path, which communicates with the inner cavity and atmosphere; and heating the laminated body while applying pressure to the laminated body with the pair of jigs in a lamination direction of the laminated body.

Disclosed are a light-emitting diode package and a method for manufacturing same. The method for manufacturing a light-emitting diode package comprises: preparing a package main body having a cavity and an air vent passageway which extends from the cavity; installing a light-emitting diode inside the cavity of the package main body; attaching a transparent member by means of an adhesive so as to cover the upper part of the cavity; and blocking the air vent passageway by forming a sealing member. As the air vent passageway is blocked after the transparent member is attached, the transparent member may be prevented from peeling off from the air pressure inside the cavity.

The invention discloses a method for ceramic bonding by utilizing a ceramic ware bonding device. The bonding device comprises a device body, a bonding cavity is formed in the device body, and a smearing device is arranged on the upper left portion in the bonding cavity; firstly, the smearing device clamps the front and back sides of ceramic, glue is smeared on and bonded to the upper end of the ceramic, and the bonding device is arranged on the upper right portion in the bonding cavity; materials needing to be bonded to the upper end of the ceramic are clamped through the bonding device and pressed to the glue for bonding, a conveying device is arranged on the lower side in the bonding cavity, and fixed point conveying is achieved through the conveying device; when the bonding device is utilized for ceramic bonfing, locating and clamping can be automatically conducted for bonding again, it is avoided that in the bonding process, due to position deflection, bonding fails, and materialsare wasted, and the work quality and efficiency are improved.

A semiconductor package includes a first semiconductor chip, a second semiconductor chip, a third semiconductor chip and a fourth semiconductor chip sequentially stacked on one another. The second semiconductor chip includes a second substrate and a second substrate recess formed in an edge of a backside surface of the second substrate. The third semiconductor chip includes a third substrate and a first metal residual material provided in a peripheral region of a front surface of the third substrate. When the second semiconductor chip and the third semiconductor chip are bonded to each other such that the front surface of the third substrate and the backside surface of the second substrate face each other, the first metal residual material is located in the second substrate recess. A first bonding pad on the backside surface of the second substrate and a second bonding pad on the front surface of the third substrate are bonded to each other.

The invention relates to a shield tunnel segment variable thickness steel ring. The shield tunnel segment variable thickness steel ring is formed by splicing steel sheets; starting from the right above of segments at 0 degree, the degree of the spliced steel sheets is increased clockwise, the areas between 345 degrees and 15 degrees, 60 degrees and 90 degrees, and 270 degrees and 300 degree of thesegments are special areas; areas on both sides of every special area within 10 degrees are gradient areas, and the other areas of the segments are common areas; the thickness of steel ring in the special areas is twice as much as that in the common areas. The shield tunnel segment variable thickness steel ring determine a reasonable and scientific reinforcing steel ring thickness, thereby improving the reinforcing effects and meanwhile reducing consumption of steel ring materials as well as the construction costs; the segments and the steel ring are anchored through expansion bolts, the areas clockwise between 330 degrees and 0 degree, 120 degrees and 150 degrees, and 210 degrees and 240 degrees of the segments serve as reinforced anchoring areas and areas outside the reinforced anchoring areas as common anchoring areas, the segments and the steel ring are anchored through the expansion bolts at an interval of 20 degrees in the reinforced anchoring areas and an interval of 30 degreesin the common anchoring areas, so that the tensile strength of the segments and the steel ring can be enhanced effectively.

The invention provides an ice preventing and ice removing wind power blade and a manufacturing method thereof. By laying a heat conducting material layer high in heat conduction coefficient in a grooved middle core material to improve the heat conduction coefficient of a wind power blade body, heat generated by heating resistors can be fast transmitted to the outer surface of the wind power bladebody, and therefore energy needed for heating the wind power blade body can be reduced to be lowest, and the problems that because of internal heating in the prior art, the interior temperature of thewind power blade body is too high, the material performance loss of the wind power blade body is caused, and consequently the service life is shortened, and combustion of the wind power blade body iscaused are solved. The heating resistors are uniformly arranged in epoxy structural glue as an adhesion agent, primary packaging is performed when adhering is performed, a glass fiber protecting layer infiltrated by resin is arranged so that the service life of the heating resistors is prolonged, the application reliability of the ice preventing and ice removing wind power blade is guaranteed, and application and popularization value is great.

The invention provides an anti-stick waterproof board with excellent water resistance. The anti-stick waterproof board consists of a base material layer, a self-adhesive layer and an isolating membrane layer which are sequentially compounded into a whole, wherein the self-adhesive layer is positioned between the base material layer and the isolating membrane layer; the isolating membrane layer does not need to be removed, and disappears after reacting with poured concrete; the self-adhesive layer has the thickness of 0.2-0.4mm, and is prepared from the following components in parts by weight: 2-10 parts of chlorobutyl rubber, 20-30 parts of high-molecular-weight butyl rubber with a viscosity average molecular weight of 400-500 thousands, 30-50 parts of medium-molecular-weight polyisobutylene with a viscosity average molecular weight of 50-100 thousands, 20-40 parts of low-molecular-weight polyisobutylene with a viscosity average molecular weight of 1000-3000, 0.5-10 parts of vinyl-terminated silicone rubber and 1-5 parts of an antioxidant; the vinyl-terminated silicone rubber is terminal vinyl silicone rubber and has a viscosity average molecular weight of 50-300 thousands, and the mole percent of vinyl is more than 1%. The invention also provides a preparation method of the anti-stick waterproof board.

The invention provides a bridge deck reinforcing method. The method comprises the steps of drilling, wherein reinforcing holes are drilled in the top surface and/or bottom surface of a bridge deck; glue filling, wherein the reinforcing holes are filled with steel bar embedding glue; steel bar distribution, wherein FRP bars are placed in the reinforcing holes. Compared with a surface bonding method in the prior art, the reinforcing method has the advantages that the FRP bars are protected and limited by a concrete structure of the bridge deck after being placed in the reinforcing holes without being affected by the external environment basically, so that FRP bar and concrete bonding property is improved and bonding failure caused by edge concrete cracking is effectively avoided. Compared with a surface-surface mounting method in the prior art, the reinforcing method has the advantage that reinforcement is conducted by drilling concrete and then placing the FRP bars in the drilled reinforcing holes instead of being conducted on the surface layer of concrete, so that damage to a concrete protection layer is avoided.

An epoxy modified cement pavement antiskid wearing layer comprises a water-borne epoxy resin bonding layer formed by spraying water-borne epoxy resin and a water-borne epoxy curing agent on a cement concrete pavement; an epoxy asphalt sealing layer, formed by sequentially spreading a first epoxy asphalt cementing material, a first aggregate and a second epoxy asphalt cementing material on the water-borne epoxy resin bonding layer, and having a first epoxy asphalt cementing material layer/first aggregate layer/second epoxy asphalt cementing material layer sandwich structure; wherein the first aggregate is limestone, diabase or basalt; a high-viscosity modified asphalt macadam sealing layer, formed by synchronously spreading high-viscosity modified asphalt and second aggregate on the epoxy asphalt sealing layer and rolling the epoxy asphalt sealing layer through a road roller, and the high-viscosity modified asphalt macadam sealing layer and the epoxy asphalt sealing layer being mutually embedded and extruded to form an integrated fusion structure; wherein the particle size of the second aggregate is not greater than that of the first aggregate, and the second aggregate is basalt or diabase; and an asphalt sealing layer, formed by spreading a sealing surface material on the high-viscosity modified asphalt macadam sealing layer.

In a metal part in which a rubber is adhered to a portion or the whole of a surface thereof, and a surface treating method of the metal part, in order to improve an adhesive property between the metal and the rubber, to make it easy to form a surface roughness in a specific portion of a metal part, and to achieve an improvement of working accuracy in the surface roughness, an improvement of mold maintenance property, a reduction of working cost, a reduction of man hour, and the like, a surface roughness for increasing an adhesive property between the metal and the rubber is formed in a portion of a surface of the metal part to which the rubber is adhered, and the surface roughness is transcribed from a mold for working the metal part to the metal part by previously providing with a surface roughness in the mold. A magnitude of the surface roughness is preferably set to be 10 μm or more and less than 60 μm.

There is provided a method for producing a metal/ceramic bonding article, the method including the steps of: bonding a metal plate 12 of an alloy containing copper and nickel directly to at least one side of a ceramic substrate 10; applying a resist 14 on a predetermined portion of the metal plate 12 to remove an undesired portion of the metal plate 12 by etching; and removing the resist 14 to form a pattern having a predetermined shape of the alloy on the ceramic substrate 10. According to this method, it is possible to reduce the displacement failure of parts to improve productivity and to prevent bonding failure during the mounting of a semiconductor device or the like thereon.