Solar cell and manufacturing method thereof
The technology of a solar cell and a manufacturing method, which is applied in the field of solar cells, can solve the problems of low conversion efficiency of solar cells and the like
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Embodiment 1
[0075] The process of making a solar cell includes:
[0076] The substrate 10 is passed into the MOCVD equipment, and the H 2 Gas, raise the temperature to perform high-temperature cleaning on the substrate 10, the temperature is 1000°C, and the above-mentioned substrate 10 is a GaAs layer;
[0077] grow Al on the substrate 10 X Ga 1-X As, forming a back field layer 21, where x=0.25, the thickness of the back field layer 21 is 100 nm, and its growth temperature is 600° C.;
[0078] A base layer 22 is grown on the back field layer 21, and each periodic structure of the base layer 22 is composed of a highly doped first substructure layer 221 and a lowly doped second substructure layer 222 arranged in sequence, and each first substructure The doping concentration of layer 221 is 1e20 / cm 3 , the doping type is N type, the thickness is 30nm, and the doping concentration of each second substructure layer 222 is 1e18 / cm 3 , the doping type is N-type. The thickness is 30nm, the ...
Embodiment 2
[0091] The difference with embodiment 1 is:
[0092] In the first battery cell, the doping concentration of each first substructure layer is 1e18 / cm 3 , the doping type is N-type, the thickness is 1.5nm, and the doping concentration of each second substructure layer is 1e16 / cm 3 , the doping type is N-type. The thickness is 1nm, the thickness of the period formed by a first substructure layer and a second substructure layer is 2.5nm, the number of periods is 200, the total thickness of the base layer is 500nm, and the growth temperature of the base layer is between 800-1000°C between.
Embodiment 3
[0094] The difference with embodiment 1 is:
[0095] In the first battery cell, the doping concentration of each first substructure layer is 1e22 / cm 3 , the doping type is N type, the thickness is 50 nm, and each second substructure layer is an intrinsic layer. The thickness is 100nm, the thickness of the period formed by a first substructure layer and a second substructure layer is 150nm, the number of periods is 20, the total thickness of the base layer is 3000nm, and the growth temperature of the base layer is between 400-600°C .
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