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High-temperature-resistant adhesive

An adhesive and high-temperature-resistant technology, which is applied in the direction of adhesives, non-polymer adhesive additives, adhesive types, etc., can solve the problems of affecting the performance of electronic components, affecting the bonding strength of adhesives, and affecting the performance of adhesives. Enhance the bonding strength, prolong the service life, and enhance the effect of high temperature resistance

Inactive Publication Date: 2020-01-07
厦门宏晨电子产品有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, when electronic components are used, they are usually fixed in the circuit by soldering tin, and solder generally needs a higher temperature to melt it first to fix the electronic components. Therefore, in the process of fixing electronic components by soldering Among them, high temperature conditions are likely to affect the performance of the adhesive, making the adhesive easy to crack, which in turn affects the bonding strength of the adhesive, and affects the performance of electronic components at the same time. Therefore, it is extremely important to provide a high temperature resistant adhesive

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0062] A preparation method of high temperature resistant adhesive, comprising the following steps:

[0063] S1, raw material mixing, specifically as follows:

[0064] In a 150L stirred tank, under normal temperature conditions, add 65kg of bisphenol A epoxy resin, stir at a speed of 1000r / min, add 15kg of dimethylimidazole, 27.5kg of calcined alumina, and 5kg of novolak epoxy resin while stirring, Stir for 15 min to form a premix.

[0065] S2, curing into glue, specifically as follows:

[0066] Heat the pre-mixture at 115°C for 35 minutes to cure the pre-mixture to obtain a high temperature resistant adhesive.

Embodiment 2

[0068] The difference with embodiment 1 is:

[0069] S1, raw material mixing, specifically as follows:

[0070] In a 150L stirred tank, under normal temperature conditions, add 60kg of bisphenol A epoxy resin, stir at a speed of 1000r / min, add 10kg of dimethylimidazole, 35kg of calcined alumina, and 7.5kg of novolak epoxy resin while stirring, Stir for 15 min to form a premix.

Embodiment 3

[0072] The difference with embodiment 1 is:

[0073] S1, raw material mixing, specifically as follows:

[0074] In a 150L stirred tank, under normal temperature conditions, add 70kg of bisphenol A epoxy resin, stir at a speed of 1000r / min, add 12.5kg of dimethylimidazole, 20kg of calcined alumina, and 10kg of novolac epoxy resin while stirring, Stir for 15 min to form a premix.

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PUM

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Abstract

The invention relates to the field of adhesives, and provides a high-temperature-resistant adhesive aiming at the problem of poor high-temperature resistance of an existing adhesive, the high-temperature-resistant adhesive comprises the following components in parts by mass: 60-70 parts of bisphenol A epoxy resin, 10 to 15 parts of 1, 2-dimethylimidazole; 20-35 parts of calcined alumina; and 5-10parts of phenolic epoxy resin. According to the high-temperature-resistant adhesive, the 1, 2-dimethylimidazole, the calcined alumina and the novolac epoxy resin cooperate with one another, so that the high-temperature resistance of the high-temperature-resistant adhesive is enhanced, normal use of electronic components is not easily affected, and the service life of the electronic components is prolonged.

Description

technical field [0001] The invention relates to the field of adhesives, more specifically, it relates to a high temperature resistant adhesive. Background technique [0002] In the electronics industry, it is usually necessary to seal, encapsulate or pot some electronic components with adhesives to play the role of waterproof, moisture-proof, shockproof, and confidentiality. [0003] However, when electronic components are used, they are usually fixed in the circuit by soldering tin, and solder generally needs a higher temperature to melt it first to fix the electronic components. Therefore, in the process of fixing electronic components by soldering Among them, high temperature conditions are likely to affect the performance of the adhesive, making the adhesive easy to crack, thereby affecting the bonding strength of the adhesive, and affecting the performance of electronic components at the same time. Therefore, it is extremely important to provide a high temperature resis...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/06C09J11/04
CPCC08K2003/2227C08L2201/08C08L2205/025C09J11/04C09J11/06C09J163/00C08L63/00C08K3/22C08K5/3445C08K13/06C08K5/47C08K5/3462C08K5/08C08K5/29C08K3/04C08K5/092C08K5/07C08K3/346C08K3/34
Inventor 林进福
Owner 厦门宏晨电子产品有限公司
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