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Ceramic capacitor

A technology of ceramic capacitors and ceramic dielectrics, which is applied in the field of capacitors, can solve the problems of many current loops in the dielectric layer, a large number of electrodes, and poor high-frequency characteristics, and achieve high assembly efficiency, good high-frequency performance, and high yield.

Inactive Publication Date: 2020-01-10
四川特锐祥科技股份有限公司
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  • Application Information

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Problems solved by technology

[0003] Traditional multilayer ceramic capacitors have the disadvantages of large number of electrodes, many current loops between dielectric layers, large inductance, and poor high-frequency characteristics.
[0004] Single-layer ceramic capacitors have good high-frequency characteristics, but low, medium and high-voltage single-layer ceramic capacitors basically adopt a plug-in package structure, which is bulky and inconvenient to assemble

Method used

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Embodiment Construction

[0036] The principles and features of the present invention are described below in conjunction with the accompanying drawings, and the examples given are only used to explain the present invention, and are not intended to limit the scope of the present invention.

[0037] Such as figure 1 , figure 2 , image 3 , Figure 4 , Figure 5 As shown, a ceramic capacitor includes a plastic package 1, a first metal electrode layer 2, a second metal electrode layer 3, a first metal pin 4, a second metal pin 5 and a single-layer ceramic dielectric 6;

[0038] The first metal electrode layer 2 and the second metal electrode layer 3 are attached to opposite sides of the single-layer ceramic medium 6, respectively;

[0039] The first metal pin 4 and the second metal pin 5 are electrically connected to the first metal electrode layer 2 and the second metal electrode layer 3 by welding;

[0040] The ceramic capacitor is packaged in SMD.

[0041] SMD package is a surface mount package. ...

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Abstract

The invention relates to a ceramic capacitor which comprises a plastic package body 1, a first metal electrode layer 2, a second metal electrode layer 3, a first metal pin 4, a second metal pin 5 anda single-layer ceramic medium 6. The first metal electrode layer 2 and the second metal electrode layer 3 are respectively attached to the two opposite surfaces of the single-layer ceramic medium 6. The first metal pin 4 and the second metal pin 5 are respectively welded and electrically communicated with the first metal electrode layer 2 and the second metal electrode layer 3. The ceramic capacitor is an SMD package. The electrode layers are arranged on the two sides of the single-layer ceramic medium, and the electrode layers are connected through the pins to generate electric fields on thetwo electrode layers so that the capacitive effect is generated between the two pins. The single-layer ceramic medium and the SMD packaging are selected so that the ceramic capacitor has the advantages of small volume, more standardized product size, high assembling efficiency, high yield and good high frequency performance.

Description

technical field [0001] The invention belongs to the technical field of capacitors, in particular to a ceramic capacitor. Background technique [0002] At present, ceramic dielectric capacitors account for about 70% of the capacitor market and become an indispensable component in electronic equipment, mainly including laminated ceramic capacitors and single-layer ceramic capacitors. [0003] Traditional multilayer ceramic capacitors have the disadvantages of large number of electrodes, many current loops between dielectric layers, large inductance, and poor high-frequency characteristics. [0004] Single-layer ceramic capacitors have good high-frequency characteristics, but low-medium-high-voltage single-layer ceramic capacitors basically adopt a plug-in package structure, which is bulky and inconvenient to assemble. Contents of the invention [0005] The present invention provides a ceramic capacitor in order to solve the above technical problems. [0006] The technical ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/12H01G4/224H01G4/236H01G4/258
CPCH01G4/12H01G4/224H01G4/236H01G4/258
Inventor 刘世军许建锋
Owner 四川特锐祥科技股份有限公司
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