76results about "Temperature compensation" patented technology

A capacitor device includes: a film capacitor element that comprises a coiled body in which an insulating layer and an electrification layer are laminated and wound together, and a pair of collector electrodes that are formed upon two opposite end faces of the coiled body; a case that comprises a capacitor housing portion within which the film capacitor element is received; a pair of inserts having insulation properties, one of which is inserted between one of the pair of collector electrodes and one of inner walls of the capacitor housing portion; and a mass of sealing and insulating material that is charged between the film capacitor element and the one of the inner walls of the capacitor housing portion.

A capacitor includes a first heating element and a first capacitor region. The first capacitor region includes dielectric layers and internal electrodes. The internal electrodes are arranged between the dielectric layers. The first heating element and the first capacitor region are connected to each other in a thermally conductive manner.

A laminated ceramic capacitor with a laminated body including a plurality of stacked ceramic layers and internal electrodes located between the ceramic layers. The laminated body has a pair of mutually opposed principal surfaces extending in the direction in which the ceramic layers extend, a pair of mutually opposed side surfaces and a pair of mutually opposed end surfaces which respectively extend in directions orthogonal to the principal surfaces. The internal electrodes are 0.4 μm or less in thickness, and are located in an area defined by a width-direction gap of 30 μm or less interposed with respect to each of the pair of side surfaces and an outer layer thickness of 35 μm or less interposed with respect to each of the pair of principal surfaces.

A method of production of a multilayer ceramic electronic device having dielectric layers with an interlayer thickness of 5 μm or less and internal electrode layers including a base metal, including the steps of firing, then annealing a stack comprised of a dielectric layer paste and an internal electrode layer paste including a base metal alternately arranged in 100 layers or more under a reducing atmosphere, treating the annealed stack by first heat treatment under a strong reducing atmosphere of an oxygen partial pressure P3 of over 2.9×10−39 Pa to less than 6.7×10−24 Pa at a holding temperature T3 of over 300° C. to less than 600° C. The stack after the first heat treatment is treated by second heat treatment under an atmosphere of an oxygen partial pressure P4 of over 1.9×10−7 Pa to less than 4.1×10−3 Pa at a holding temperature T4 of over 500° C. to less than 1000° C.

A Dense Energy Ultracapacitor DEUC preform, thin film, and module and methods of fabrication therefor, are provided. The DEUC thin film includes: a multilayer polymer thin film (2210) including a plurality of matched polymer layers (2215) having DEUC structural features resulting from drawing, by a draw process, and / or stretching, of a multilayer polymer DEUC preform (2201) having size, shape, and an arrangement of matched polymer layers (2205), where the multilayer polymer thin film (2210) having DEUC structural features in at least one dimension proportionally reduced in comparison to the same features in the Preform (2201). The multilayer polymer thin film includes negative and positive electrodes (903) made from conducting polymer and spaced apart by suspended particle high dielectric energy storage media (904) including high dielectric nano and / or micro sized particles (901, 902) suspended in a binder (904) including at least one of a polymer, a copolymer, and a terpolymer. All the layers (903, 904) are bound and unified together.

A capacitor assembly is disclosed. The capacitor assembly includes a housing. The capacitor assembly further includes a plurality of capacitors disposed within the housing. Furthermore, the capacitor assembly includes a thermally conductive article disposed about at least a portion of a capacitor body of the capacitors, and in thermal contact with the capacitor body. Moreover, the capacitor assembly also includes a heat sink disposed within the housing and in thermal contact with at least a portion of the housing and the thermally conductive article such that the heat sink is configured to remove heat from the capacitor in a radial direction of the capacitor assembly. Further, a method of forming the capacitor assembly is also presented.

A capacitor that has the features of heat dissipation and energy conservation comprises a capacitor core, an aluminum shell surrounding the capacitor core, the aluminum shell is covered with rubber that completely covers the top of the capacitor core, then with the use of an extruding machine, the upper orifice of the aluminum shell is extruded and sealed up around the rubber completely; the outer surface of the aluminum is formed with an aluminum oxidized insulating layer after the aluminum shell is processed through an aluminum metal surface transformation treatment, since the aluminum shell is not covered with plastic film (or sleeve), heat dissipation is enhanced; in addition, since plastic film or sleeve is not used, no pollution is occurred, and hence more friendly to the environment; furthermore, since heat generation is low, energy is conserved.

This film capacitor is configured such that: the film capacitor is provided with a capacitor element having a metallikon electrode formed at an end portion, a bus bar connected to the metallikon electrode, a case having a housing section for housing the capacitor element and the bus bar, a cover member covering an opening of the housing section, and a heat conducting member that is disposed between the bus bar and the cover member; the cover member has a protruding section on the side facing the heat conducting member; the protruding section is in contact with the heat conducting member; and the heat conducting member is in contact with the bus bar. With such configuration, the film capacitor having further improved heat dissipating characteristics can be provided.

A monolithic capacitor including a sintered body formed from a TiO2-containing reduction-resistant dielectric ceramic material; a plurality of internal electrodes which are formed inside the sintered body, the electrodes being formed of a base metal; and first and second external electrodes which are formed on the sintered body, the internal electrodes being electrically connected to the external electrodes; wherein the amount of Ti contained in a secondary phase of the sintered body is about 2 wt. % or less as TiO2. A process for producing the monolithic capacitor of the present invention is also disclosed.

An electronic component includes a first capacitor including a first dielectric material having a permittivity that is inversely proportional to temperature; and a second capacitor connected in parallel with the first capacitor and including a second dielectric material having a permittivity that is directly proportional to temperature.

In a nonflammable and disaster prevention type capacitor, the sealing property of the capacitor container is increased, a plurality of capacitor elements are collected, is accommodated in the container, and its inside is vacuum deaerated, the perfluorocarbon liquid deaerated by a deaeration apparatus is filled, and a capacitor which maintains an amount of residual air in the perfluorocarbon liquid to be not larger than 5%, is formed. A fluoride liquid to be filled in the container, consisting of a connection of carbon, fluorine and oxygen, and which includes per fluoropolyether by not smaller than 90% and whose boiling point is not lower than 120° C. and not higher than 270° C., and whose dynamic viscosity at 25° C. is from 0.9 mm2 / s to not larger than 14 mm2 / s, is impregnated into the capacitor element. An absolute pressure in the container is not smaller than 120 kPa and not larger than 300 kPa.

A thin film capacitor with an arbitrary temperature coefficient of capacitance can be obtained by using only tow kinds of dielectric thin film capacitor, wherein the dielectric thin film having a prescribed temperature coefficient of capacitance is formed on the surface of a lower electrode formed on a substrate, a second dielectric film having a different temperature coefficient of capacitance from the temperature coefficient of capacitance of the prescribed temperature coefficient of capacitance is formed so as to cover from the upper edge of the dielectric thin film to the step portion of the dielectric thin film, and an upper electrode is formed so as to cover the dielectric thin film and second dielectric film, and wherein the temperature coefficient of capacitance is determined by adjusting the overlap area of the lower electrode and upper electrode between the lower electrode and upper electrode.

A box-shaped inner case (3) is accommodated in a box-shaped outer case (2), and refrigerant flow passages (27) are formed at five surfaces except opening surfaces (14, 24) by gaps between the inner and outer cases. A Gap of an opening edge of the outer case (2) and an opening edge of the inner case (3) is covered with a frame-shaped cover (6). A capacitor element (4) formed from a film capacitor is placed in the inner case (3), and the inner case (3) is filledwithpottingmaterial (5) having thermal conductivity so that the capacitor element (4) except the terminals (4a, 4b) is embedded. Cooling water flows along a longitudinal direction of the outer case (2) with one of refrigerant pipe connecters (15) being a refrigerant inlet and the other of the refrigerant pipe connecters (15) being a refrigerant outlet.

A multi-layer ceramic capacitor assembly includes a first terminal assembly member formed by arranging first protruded members at specific intervals, a second terminal assembly member formed by arranging second protruded members at specific intervals so that they face the respective first protruded members, insulated heat dissipation members supported by the first protruded members and the second protruded members and disposed therein, and multi-layer ceramic capacitors alternately disposed between the insulated heat dissipation members so that each multi-layer ceramic capacitor comes into contact with one side and the other side of each insulated heat dissipation member in a first direction, the end on one side of the multi-layer ceramic capacitor in a second direction orthogonal to the first direction is connected to the first terminal assembly member, and the end on the other side of the multi-layer ceramic capacitor in the second direction is connected to the second terminal assembly member.

Disclosed is a high-voltage AC capacitor for reactive power compensation of 10 kV-35 kV power grid, and in particular to a high-voltage AC capacitor with a high-voltage switching switch provided therein, as well as a structure for prolonging the service life of a thin film metalized high-voltage capacitor and a control method for prolonging the service life of the thin film metalized high-voltage capacitor. The AC capacitor is formed by multiple intelligent switch capacitor units connected in series, and each capacitor unit is formed by a switch contact (K11-Kn1) and a capacitor (C1-Cn) connected in series. If there are N capacitor units, when each switch contact is disconnected, the endurable voltage of each switch contact, the endurable voltage between the switch contact and a coil and the voltage each capacitor withstands are 1 / Nth of the total voltage; when the switch operates, all the contacts operate at the same instant, the switch contacts are prevented from striking sparks or discharging arcs under the protection of the contact protection circuits, and the high-voltage switch is realized through multiple air contact switches connected in series.

The invention relates to the technical field of film capacitors for motor controllers, in particular to a film capacitor integrated with a safety filter capacitor and a motor controller. The film capacitor comprises a capacitor shell, the capacitor shell is internally provided with a plurality of capacitor bodies arranged side by side and at intervals; the inner wall of the capacitor shell and each capacitor body are fixed into one body through a packaging and filling rubber block; direct current input copper bars are symmetrically arranged at two ends of the capacitor bodies, and the direct current input copper bars are extended out of the packaging and filling rubber block and are installed on the capacitor shell; and the direct current input copper bars are sleeved with an X / Y capacitorfiltering circuit board and a ferrite common mode inductor. According to the film capacitor integrated with the safety filter capacitor and the motor controller, the direct current input copper barsare symmetrically arranged, any one of the direct current input copper bars can be selected to be connected with the input end of the motor controller so as to improve the adaptability of the product;and moreover, the ferrite common mode inductor and the X / Y capacitor filtering circuit board are integrated to improve the performance reliability of the film capacitor.

The invention provides a multilayer ceramic capacitor having excellent heat dissipation property. The multilayer ceramic capacitor 10 has a first metal layer 14 having many holes 14a, and a second metal layer 15 having many holes 15a, with a clearance CL provided in between in the length direction, on the other height-direction side face of the capacitor body; the first metal layer 14 is partiallycovered by a third part 12c of a first external electrode 12, while the remainder is exposed; and the second metal layer 15 is partially covered by a third part 13c of a second external electrode 13,while the remainder is exposed.

A multilayer ceramic electronic component that has a multilayer portion having an outer layer portion adjacent region including an area in contact with an outer layer portion that forms a thermal-shock absorbing portion that includes curved ceramic layers and inner electrode layers smoothly varying in thickness from point to point. A region to an inside of the thermal-shock absorbing portion forms a normal multilayer portion that includes ceramic layers with less curvature than the ceramic layers in the thermal-shock absorbing portion and inner electrode layers with less variation in thickness from point to point in a direction along a principal surface of the outer layer portion than the inner electrode layers in the thermal-shock absorbing portion.

A capacitor module is provided which includes a plurality of capacitors, a capacitor case, and a sealing resin with which the capacitor case is filled to seal the capacitors in the capacitor case. The capacitor case includes inward-facing portions of an outer wall thereof each of which bulges or protrudes between every adjacent two of the capacitors. As viewed in a height-wise direction perpendicular both to a direction in which the inward-facing portions protrude and to a direction in which two of the capacitors adjacent each other across one of the inward-facing portions are aligned, the intervening inward-facing portion traverses a line segment passing through centers of the two adjacent capacitors. This structure minimizes thermal interference between the capacitors.

The invention discloses a device and method for reducing the capacitor temperature coefficient, and the device comprises an enclosed space which consists of a capacitor upper cover, a capacitor housing and a capacitor lower cover, and the interior of the enclosed space is provided with a fixed cover, a capacitor core, a fixed plate, a core pedestal, a support plate, a support spring, a push plate, and an expander. According to the invention, the polar plate spacing of each capacitor element in the capacitor core is compressed or amplified by changing the height (namely the core compaction coefficient) of the capacitor core, so that the adjustment of the capacitance of the core is realized, and the temperature coefficient of the capacitor is automatically reduced.

A multilayer ceramic electronic component includes an element body and a terminal electrode. The element body includes internal electrode layers and insulation layers alternately laminated in a lamination direction. The terminal electrode is formed on an outer surface of the element body to be contacted and connected with the internal electrode layers. The terminal electrode includes an end-side electrode part and an upper-side electrode part. The end-side electrode part covers a leading end of the element body where the internal electrode layers are led. The upper-side electrode part is formed on a part of an upper surface of the element body and continues to the end-side electrode part. The terminal electrode is not substantially formed on a lower surface of the element body located on the other side of the upper surface along the lamination direction.

The invention relates to a ceramic capacitor which comprises a plastic package body 1, a first metal electrode layer 2, a second metal electrode layer 3, a first metal pin 4, a second metal pin 5 anda single-layer ceramic medium 6. The first metal electrode layer 2 and the second metal electrode layer 3 are respectively attached to the two opposite surfaces of the single-layer ceramic medium 6. The first metal pin 4 and the second metal pin 5 are respectively welded and electrically communicated with the first metal electrode layer 2 and the second metal electrode layer 3. The ceramic capacitor is an SMD package. The electrode layers are arranged on the two sides of the single-layer ceramic medium, and the electrode layers are connected through the pins to generate electric fields on thetwo electrode layers so that the capacitive effect is generated between the two pins. The single-layer ceramic medium and the SMD packaging are selected so that the ceramic capacitor has the advantages of small volume, more standardized product size, high assembling efficiency, high yield and good high frequency performance.

A ceramic electronic component includes a multilayer body, an electronic component main body including first and second outer electrodes on the surface of multilayer body, a first substrate connection terminal bonded to at least one of the first outer electrode and the multilayer body by a bonding material that is electrically insulating, and a first metal terminal electrically connecting the first outer electrode and the first substrate connection terminal, in which, while the first metal terminal maintains an elastically deformed state, a first end portion thereof is bonded to the first outer electrode by an electrically conductive bonding material, and a second end portion thereof is bonded to the first substrate connection terminal by a bonding section with a different melting point from that of the bonding material.

A film capacitor is presented. The film capacitor includes a thermally conductive support. The thermally conductive support includes a core including a first end and a second end. The thermally conductive support further includes a protrusion extending from at least one of the first end and the second end of the core, where at least one of the core and the protrusion includes a phase change material. Further, the film capacitor also includes a plurality of films disposed on at least a portion of the thermally conductive support, where the plurality of films includes a plurality of electrode films and a dielectric film. Further, the thermally conductive support for the film capacitor and a method of forming the film capacitor are also presented.

The invention relates to the field of high-voltage protection, in particular to a differential pressure damping type protection method and device for a self-healing capacitor. According to the methodprovided by the invention, temperature compensation is realized and the pressure inside the capacitor is detected through an independent standard air chamber, once the difference between the pressureand the pressure of the standard air chamber reaches a set value, the standard air chamber is compressed to enable the release to be in a release state, and the moving contact is pushed by the energystorage spring to be closed with the static contact; and a capacitor connected in parallel with the capacitor is short-circuited. In order to limit the discharge current of the capacitor to be overlarge, a damper is connected in the action process, the discharge current is reduced, and secondary faults are avoided. The two poles of the capacitor are short-circuited, so that the faulty capacitor does not bear voltage any more, further development of faults is avoided, meanwhile, an external protection circuit can accurately and reliably detect faults of the capacitor device, the faulty capacitor can quit operation in time, and the purpose of avoiding fault expansion is achieved.