PCB

A PCB board and sub-board technology, applied in the field of electronic devices, can solve the problems of cost increase, waste, and high cost of circuit boards, and achieve the effect of reducing production costs

Inactive Publication Date: 2020-01-14
GOERTEK OPTICAL TECH CO LTD
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the HDI board can reduce the size of the PCB board to a certain extent, it also makes the cost of the circuit board higher and higher.
And in some cases, not all PCB boards need to be designed with blind holes and buried holes. For example, on a large PCB board, only one/two IC chips have a small pad spacing,

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • PCB
  • PCB
  • PCB

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0029] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.

[0030] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.

[0031] In all examples shown and discussed herein, any specific values ​​should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have dif...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a PCB which comprises a mother board body, an IC chip and a daughter board body. The IC chip is provided with a plurality of first solder pads, and the spacing between the adjacent first solder pads among a plurality of first solder pads is less than 0.65 mm. The IC chip is arranged on the daughter board body, and the daughter board body is arranged on the mother board body. The daughterboard body comprises two surface layers. The first surface layer of the daughter board body is provided with a plurality of second solder pads. The IC chip is packaged in the second surface layer of the daughter board body.The spacing between the adjacent second solder pads among a plurality of second solder pads is greater than or equal to 0.65 mm.The first solder pads and the second solder pads are electrically connected through blind holes and buried holes, and the second solder pads are electrically connected with the mother board body.

Description

technical field [0001] The present invention relates to the technical field of electronic devices, and more specifically, to a PCB board. Background technique [0002] In the electronics industry, the circuit board is a very important electronic component, a support for electronic components, and a carrier for the electrical connection of electronic components. Nowadays, as electronic products are gradually becoming thinner and lighter, their replacement speed is also accelerating, and the functional requirements are becoming more and more abundant, and the packaging of electronic devices is also decreasing day by day. Therefore, the design of circuit boards is becoming more and more dense. HDI ( High Density Interconnector) boards are more and more widely used. Although the HDI board can reduce the size of the PCB board to a certain extent, it also makes the cost of the circuit board higher and higher. And in some cases, not all PCB boards need to be designed with blind h...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H05K1/14H05K1/11H05K1/18
CPCH05K1/111H05K1/141H05K1/185H05K2201/09409H05K2201/10007
Inventor 马菲菲
Owner GOERTEK OPTICAL TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap