High-power power supply backplane for high density assembling

Abstract

The invention discloses a high-power power supply backplane for high density assembling. The high-power power supply backplane comprises a PCB. At least one basic power supply unit is formed on the PCB. The basic power supply unit comprises an incoming wire pad L, an incoming wire pad N, a power supply L layer, a power supply N layer and at least one power supply interface. An insulating medium isfilled between the power supply L layer and the power supply N layer. The incoming wire pad L is electrically connected with the power supply L layer.The incoming wire pad N is electrically connectedwith the power supply N layer.The power supply L layer and the power supply N layer are respectively electrically connected with the L pin and the N pin of the power supply interface. The high-powerpower supply backplane has good application flexibility and high adaptability and can realize high-density assembling of calculation plug-ins and has small occupied space, uniform heating, high powersupply safety and good maintainability.

Description

technical field [0001] The invention relates to the technical field of electrical engineering and equipment power generation, power transformation or power distribution, in particular to a high-power power supply backplane for high-density assembly. Background technique [0002] At present, power distribution units (PDUs) are generally used inside existing server cabinets or computer cabinets to supply power to servers or computing plug-in units, and power cables lead power from PDU power slots to servers or computing plug-in units. Multiple servers or computing plug-in units need to be powered by multiple power cables from the PDU. [0003] Commonly used PDUs generally have low power, low power density, large space occupation, chaotic wiring, and easy local hotspots, which cannot meet the needs of computing loads with increasing power and higher space requirements. To really achieve clear layout, neat line sequence, clear marking, and easy maintenance, it often requires ve...

AI Technical Summary

Problems solved by technology

[0003] Commonly used PDUs generally have low power, low power density, large space occupation, chaotic wiring, easy to generate local hot spots, and cannot meet the needs of computing loads with increasing power and higher space requirements.

To really achieve clear layout, regular line order, clear marking, and easy maintenance, it often requires very professional wiring company professionals, which are expensive, long working hours, heavy workload, and error-prone

In the subsequent use, if any circuit problems are found, they need to be checked one by one, which is time-consuming and laborious, and the maintainability is low.

[0004] For this reason, the patent document with the notification number CN102609058B discloses a "cabinet-type modular high-density blade server system", which relates to the server field and aims to provide a large-scale server system with high density, modular design, and easy deployment; including Main cabinet, server host blade subsystem, management subsystem A, power supply subsystem, and cabinet backplane subsystem; the power supply subsystem includes power modules and management subsystem B; As the data signal transmission center, the backplane subsystem has data signal connections with the server host blade subsystem, management subsystem A, power module, and management subsystem B; the cabinet backplane subsystem also serves as the power transmission center for receiving power supply subsystems. Power output, and power supply to the server host blade subsystem, management subsystem A, and management subsystem B, but the flexibility is relatively poor

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