A high-power power supply backplane for high-density assembly

Abstract

The invention discloses a high-power power supply backplane for high-density assembly, including a PCB board, and at least one basic power supply unit is formed on the PCB board, and the basic power supply unit includes: an incoming line pad L, an incoming line welding pad Disk N, power supply L layer, power supply N layer, and at least one power supply interface, an insulating medium is filled between the power supply L layer and the power supply N layer, and the incoming line pad L is electrically connected to the power supply L layer, The incoming line pad N is electrically connected to the N layer of the power supply, and the L layer and the N layer of the power supply are respectively electrically connected to the L pin and the N pin of the power supply interface. The invention has good application flexibility and high adaptability, can realize high-density assembly of computing plug-ins, occupies small space, generates heat evenly, has high power supply security, and has good maintainability.

Description

Technical field [0001] The present invention relates to the field of electricity, substation, or distribution techniques of electrical engineering and equipment, and more particularly to a high-power supply back plate facing high density assembly. Background technique [0002] At present, existing server cabinets or computer cabinets are generally powered by power distribution unit (PDU) for servers or computing plug-in units, and the power cord introduces power from the PDU power slot into the server or calculates the plug-in unit. Multiple servers or computational plug-in units require power supply from the PDU to extract the multi-channel power cord. [0003] Common PDU general power is not high, the power supply is very low, the occupancy is large, the trail is confusing, and it is easy to generate local hotspots. It cannot meet the use of the power to be increasing and larger. To be clear, the line sequence regulation, the mark is clear, easy to maintain, often require a ver...

AI Technical Summary

Problems solved by technology

[0003] Commonly used PDUs generally have low power, low power density, large space occupation, chaotic wiring, easy to generate local hot spots, and cannot meet the needs of computing loads with increasing power and higher space requirements.

To really achieve clear layout, regular line order, clear marking, and easy maintenance, it often requires very professional wiring company professionals, which are expensive, long working hours, heavy workload, and error-prone

In the subsequent use, if any circuit problems are found, they need to be checked one by one, which is time-consuming and laborious, and the maintainability is low.

[0004] For this reason, the patent document with the notification number CN102609058B discloses a "cabinet-type modular high-density blade server system", which relates to the server field and aims to provide a large-scale server system with high density, modular design, and easy deployment; including Main cabinet, server host blade subsystem, management subsystem A, power supply subsystem, and cabinet backplane subsystem; the power supply subsystem includes power modules and management subsystem B; As the data signal transmission center, the backplane subsystem has data signal connections with the server host blade subsystem, management subsystem A, power module, and management subsystem B; the cabinet backplane subsystem also serves as the power transmission center for receiving power supply subsystems. Power output, and power supply to the server host blade subsystem, management subsystem A, and management subsystem B, but the flexibility is relatively poor

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