Array substrate, manufacturing method and display panel
A technology of an array substrate and a manufacturing method, which are applied in the fields of an array substrate, a manufacturing method and a display panel, can solve the problems of inability to monitor the etching U% of an insulating layer, difficulty in process optimization, increase in cost, etc., so as to improve the process yield and save money. Power consumption, the effect of saving production costs
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[0061] First embodiment
[0062] Figure 2a to Figure 2k It is a schematic diagram of the manufacturing process of the array substrate in the first embodiment of the present invention, which is used to manufacture the above-mentioned array substrate, such as Figure 2a to Figure 2k As shown, the manufacturing method includes: forming a plurality of TFTs 12 arranged in an array on a substrate 11, each TFT 12 includes a gate 121, a gate insulating layer 122, an active layer 123, a source 124 and a drain 125. Specifically, a first metal layer (not shown) is deposited on the substrate 11, and the first metal layer is patterned to form a scan line (not shown) and a gate 121; and the gate is deposited on the substrate 11. The insulating layer 122, the gate insulating layer 122 covers the scan line and the gate 121; an active layer film is deposited on the gate insulating layer 122, and the active layer film is patterned to form the active layer 123, the active layer 123 It can be amorp...
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[0069] Second embodiment
[0070] Figure 3a to Figure 3k It is a schematic diagram of the manufacturing process of the array substrate in the second embodiment of the present invention. The implementation of this embodiment is basically the same as that of the first embodiment, and the similarities are not repeated here. The differences include:
[0071] A second insulating layer 16 covering the common electrode 15 is formed, and the second insulating layer 16 also covers the exposed flat layer 14 and the first insulating layer 13 at the same time;
[0072] A dry etching process is used to remove the second insulating layer 16 at the position of each contact hole 19 to expose the first insulating layer 13 below at the position of each contact hole 19;
[0073] A third insulating layer 17 covering the second insulating layer 16 is formed. The third insulating layer 17 also covers the exposed first insulating layer 13. The second insulating layer 16 is made of a material that can be dr...
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