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Low coefficient of friction vinyl composition

A composition, vinyl technology, applied in the direction of frictional elements, special packaging items, types of packaging items, etc.

Active Publication Date: 2022-04-19
DOW GLOBAL TECH LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is difficult to maintain a constant low COF under different environmental conditions (such as time, high temperature, high pressure, and various conversion processes) using conventional migratory slip agents

Method used

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  • Low coefficient of friction vinyl composition
  • Low coefficient of friction vinyl composition
  • Low coefficient of friction vinyl composition

Examples

Experimental program
Comparison scheme
Effect test

example

[0219] Materials used in the examples are provided in Table 1A below.

[0220] Table 1A

[0221]

[0222] 1 Based on the average of three samples.

[0223] Multilayer film samples were fabricated on-line at a Collin coextrusion job using the conditions in Table 1B.

[0224] Table 1B

[0225] parameter Collin line value unit The average thickness 50 μm B.U.R. 2.5 Die diameter 60 mm Die gap 1.8 mm Temperature Profile - Extruder A 180-220-230-240 ℃ Temperature Profile - Extruder B 185-210-235-235 ℃ Temperature Profile - Extruder C 200-220-235-240 ℃ temperature, mold 230 ℃ corona treatment 40 Dyne output rate 22 kg / h layer distribution ratio 20:60:20 A:B:B

[0226] The layer configuration is provided in Table 2 below. Each multilayer film structure is formed from the following: a first layer with a volume of 20% by volume of the multilayer film, a second layer with a volume...

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Abstract

The present disclosure provides a composition. The composition comprises: (A) an ethylenic polymer; and (B) a slip agent blend, based on the total weight of the slip agent blend, the slip agent blend comprising (i ) greater than 50 wt% to 99 wt% of a first polydimethylsiloxane having a number average molecular weight (Mn) of 30,000 g / mol to less than 300,000 g / mol; and (ii) 1 wt% to less than 50 wt% of a second Polydimethylsiloxane having a number average molecular weight (Mn) of 300,000 g / mol to 2,000,000 g / mol. The present disclosure also provides a film having a layer comprising the composition.

Description

Background technique [0001] The present disclosure relates to vinyl compositions containing slip agents and films containing the vinyl compositions. [0002] Film layers formed from vinyl polymers are used in multilayer films for a variety of applications including, for example, food packaging and specialty packaging. Ethylene polymer outer film layers require a low coefficient of friction (COF) (eg, less than 0.35) for efficient film processing, eg, in a manufacturing or packaging line. To achieve low COF, slip agents are often added to the vinyl polymer outer layer. Conventional slip agents include unsaturated fatty acid amides, such as erucamide and oleamide, which are known to reduce the COF of membranes by migrating to the membrane surface. However, it is difficult to maintain a constant low COF under different environmental conditions such as time, high temperature, high pressure, and various conversion processes using conventional migrating slip agents. [0003] The ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B27/32C08J5/18C08L23/08C08L23/06C08L23/04
CPCB32B27/32C08J5/18C08L23/0815C08L2203/10C08L2203/162C08L2310/00B32B7/06B32B7/12B32B27/08B32B27/18B32B27/306B32B27/308B32B27/34B32B27/36B32B2255/10B32B2255/26B32B2270/00B32B2274/00B32B2307/31B32B2307/746B32B2439/46B32B2439/70C08L2205/035C08J2323/08C08J2423/06C08J2483/04C09D183/04C08G77/04C08L23/06C08L23/08B32B2250/02B32B2250/242B32B2250/03B32B2250/05B32B27/20B32B2307/71B32B27/22B32B2307/4026B32B2250/04B32B27/327B32B2307/21B32B2307/3065B32B2307/732B32B2553/00C08L83/04C08K3/34B32B27/283B32B2323/046B32B2383/00B32B2475/00C08L2207/066
Inventor O·昂加依C·洛普
Owner DOW GLOBAL TECH LLC