High-precision integrated three-dimensional measurement system based on MEMS

A three-dimensional measurement and high-precision technology, applied in the field of three-dimensional imaging, can solve the problems of inaccurate three-dimensional information measurement, and achieve the effect of simple optical system, improved light energy utilization rate and high reflectivity

Active Publication Date: 2020-01-24
成都市众智三维科技有限公司
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Problems solved by technology

[0004] Aiming at the above-mentioned deficiencies in the prior art, a MEMS-based high-precision integrated three-dimensional measurement system provided by the present invention solves the problem of inaccurate measurement of three-dimensional information of objects

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  • High-precision integrated three-dimensional measurement system based on MEMS
  • High-precision integrated three-dimensional measurement system based on MEMS
  • High-precision integrated three-dimensional measurement system based on MEMS

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Embodiment Construction

[0028] The specific embodiments of the present invention are described below so that those skilled in the art can understand the present invention, but it should be clear that the present invention is not limited to the scope of the specific embodiments. For those of ordinary skill in the art, as long as various changes Within the spirit and scope of the present invention defined and determined by the appended claims, these changes are obvious, and all inventions and creations using the concept of the present invention are included in the protection list.

[0029] Such as figure 1 As shown, a MEMS-based high-precision integrated three-dimensional measurement system includes a fringe projection subsystem, an image acquisition subsystem, and a system control unit. The fringe projection subsystem includes sequentially connected LD lasers, Powell prisms, and MEMS one-dimensional vibrating mirrors. , the system control unit includes a control chip, an LD laser driver and feedback mod...

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Abstract

The invention discloses a high-precision integrated three-dimensional measurement system based on an MEMS. A single reflector enables the size of a chip to be small, the structure is compact, and theweight is light. A laser point light source is incident and imaged through Powell Lenses, so that an optical system is simpler. The reflectivity of an MEMS galvanometer is high, and the utilization rate of light energy is greatly improved. High-speed stable scanning and a wide scanning angle are sufficient to cover a measured object. The precision of a sinusoidal fringe pattern produced by the MEMS is high, and the phase can be adjusted in real time according to the measurement requirement.

Description

technical field [0001] The invention relates to the technical field of three-dimensional imaging, in particular to a MEMS-based high-precision integrated three-dimensional measurement system. Background technique [0002] The technical solution usually adopted by the traditional active structured light 3D measuring instrument is: first use the projection device to project the structured light onto the surface of the measured object from one angle, and then use the image acquisition device to record the deformed fringe image modulated by the height of the measured object from another angle , and then digitally demodulate the three-dimensional coordinate information of the measured object from the obtained deformed fringe image. Due to the simple principle of binocular structured light 3D measurement, traditional 3D measuring instruments generally use binocular cameras as deformed fringe image acquisition equipment, which greatly increases the size of the 3D measuring instrume...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B11/25
CPCG01B11/2527G01B11/254
Inventor 魏永超陈锋黎新
Owner 成都市众智三维科技有限公司
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