A kind of preparation device of epoxy resin sodium silicate microcapsule

A technology for preparing equipment and epoxy resin, which is applied in the field of machinery, can solve the problems of complex production methods, time-consuming, unsuitable for mass production, etc., achieve the effect of simple and convenient production process and improve production efficiency

Active Publication Date: 2021-07-02
SHANXI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, its production method is complicated and time-consuming, and it is not suitable for mass production

Method used

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  • A kind of preparation device of epoxy resin sodium silicate microcapsule
  • A kind of preparation device of epoxy resin sodium silicate microcapsule
  • A kind of preparation device of epoxy resin sodium silicate microcapsule

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Embodiment Construction

[0040] The present invention will be described in more detail below in conjunction with the accompanying drawings.

[0041] figure 1 As shown, a preparation device for epoxy resin sodium silicate microcapsules includes a metal container, a cutting device, a pushing device, a transmission device, a storage device, an adsorption device, the cutting device is connected with the pushing device, and the transmission device is located below the cutting device. On the left and above, the storage device is located below the cutting device, and the adsorption device is located below the first conveyor belt.

[0042] The cutting device is composed of a rectangular metal cutting plate 1, a rectangular metal cutting plate 2, a baffle plate 3 and a baffle plate 4, and the two sides of the rectangular metal cutting plate 2 are respectively welded with the baffle plate 3 and the baffle plate 4. Rectangular metal cutting board 1 and rectangular metal cutting board 2 are identical in size and...

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Abstract

A preparation device for epoxy resin sodium silicate microcapsules belongs to the mechanical field and is mainly used for the production of concrete self-repairing microcapsules. The cutting device is connected with the pushing device, the conveying device is located below, on the left side and above the cutting device, the storage device is located below the cutting device, and the absorbing device is located below the first conveyor belt. The manufacturing procedure of the invention is simple and convenient, and the production efficiency is improved.

Description

technical field [0001] The invention belongs to the field of machinery, and is mainly used for the production of concrete self-repairing microcapsules, and specifically relates to a preparation and cutting device of epoxy resin sodium silicate microcapsules. Background technique [0002] Concrete self-healing microcapsule technology plays an important role in the construction field. This technology can make concrete repair its cracks by itself, thereby improving the service life of concrete buildings and enhancing their durability. At present, there is a sodium silicate microcapsule that works well, which can effectively repair cracks in concrete. In 2018, Mr. Jiang Shenyang studied this kind of microcapsules in the article "Research on Life Prediction of Self-repairing Concrete Added with Sodium Silicate Repairing Agent and Optimum Restoring Agent Dosage" published in the 02 issue of the "Concrete" journal. However, its production method is complicated and time-consuming, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B01J13/02B07B1/04C04B24/28
CPCB01J13/02B07B1/04C04B40/0039C04B24/281C04B22/00C04B2103/0068
Inventor 曹瑞东郑思佳王丽马兴赟刘扩
Owner SHANXI UNIV
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