Cooling sizing device and method for hot melting glue preparing and machining

Abstract

The invention relates to a cooling sizing device for hot melting glue preparing and machining. The cooling sizing device comprises a base, a glue discharging unit, a sizing unit and a cooling circulation unit. The glue discharging unit and the cooling circulation unit are installed at the upper end of the base. The sizing unit is installed at the upper end of the glue discharging unit. The outer wall of the sizing unit is connected with the cooling circulation unit through a pipeline. By means of the cooling sizing device and method for hot melting glue preparing and machining, a sizing methodfor dragging and supporting a glue bar is adopted, and therefore the phenomenon that the formed hot melting glue bar is bent is prevented; due to cleaning of the wall of a cooling cylinder and replacing, filtering and re-cooling of cooling liquid, impurities in the cooling liquid in the cooling cylinder are reduced, the temperature in the cooling cylinder is maintained and cannot be increased dueto hot melting glue, and therefore the problems that the hot melting glue is not subjected to cooling sizing in time, consequently impurities of the hot melting glue in the cooling liquid are even stuck to the wall of the cooling cylinder, the impurities may be stuck to the glue bar after the content is too high, and burrs, protrusions and the like happen to the glue bar are solved.

Description

technical field [0001] The invention relates to the technical field of hot melt adhesive production, in particular to a hot melt adhesive preparation, processing, cooling and shaping device and method. Background technique [0002] Hot melt adhesive (English name: Hot Glue) is a kind of plastic adhesive. Within a certain temperature range, its physical state changes with temperature, but its chemical properties remain unchanged. It is non-toxic and tasteless, and is an environmentally friendly chemical product. Because the product itself is solid, easy to pack, transport, store, solvent-free, non-polluting, and non-toxic; and it has the advantages of simple production process, high added value, strong bonding strength, and fast speed. Hot melt adhesive is a solid meltable polymer that does not require solvents and does not contain 100% moisture; it is solid at room temperature, and when heated and melted to a certain temperature, it becomes a fluid and viscous liquid. The m...

AI Technical Summary

Problems solved by technology

The existing production process has the following problems: 1. There is no traction when the hot-melt glue stick is shaped, so that the formed hot-melt glue stick will bend; Hot melt impurities appear in the coolant, and even adhere to the wall of the cooling cylinder. When the content is too high, it may adhere to the glue stick, resulting in burrs and bumps on the glue stick

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