High-strength IF steel plate with yield strength of 170-300 Mpa level and production method
A technology of yield strength and production method, applied in the field of high-strength IF steel plate, can solve the problems of low strength of ultra-deep drawing grade IF steel plate
Inactive Publication Date: 2020-02-07
MAANSHAN IRON & STEEL CO LTD
4 Cites 2 Cited by
AI-Extracted Technical Summary
Problems solved by technology
The invention provides a high-strength IF steel plate with yield strength of 170-300 Mpa level and a production method. The steel plate is prepared from, by mass, 0.004-0.010% of C, smaller than or equal to 0.030% of Si, 0.30-1.10% of Mn, smaller than or equal to 0.015% of P, smaller than or equal to 0.015% of S, 0.010-0.060% of Als, 0.010-0.080% of Ti, 0.010-0.060% of Nb, 0.010-0.050% of Cu, 0.0005-0.0080% of N, smaller than or equal to 0.0050% of O and the balance Fe and unavoidable impurity elements. Compared with the prior art, the high-strength IF steel plate has the advantages that the yield strength is greater than or equal to 170 MPa, the tensile strength is 330-460 MPa, the A80 is greater than or equal to 36%, the n value is greater than or equal to 0.19, the r value is greater than or equal to 1.6, and good matching of the strength and formation performance is achieved.
Steel platesUltimate tensile strength
- Experimental program(1)
- Comparison scheme(1)
|Yield strength||170.0 ~ 300.0||mPa|
|Tensile strength||330.0 ~ 460.0||mPa|
Description & Claims & Application Information
We can also present the details of the Description, Claims and Application information to help users get a comprehensive understanding of the technical details of the patent, such as background art, summary of invention, brief description of drawings, description of embodiments, and other original content. On the other hand, users can also determine the specific scope of protection of the technology through the list of claims; as well as understand the changes in the life cycle of the technology with the presentation of the patent timeline. Login to view more.