Multi-stage driving circuit

Abstract

The invention discloses a multi-stage driving circuit. The multi-stage driving circuit comprises thin film transistors T1, T2, T3, T4, T5, T6, T7, T8, T9, T10, T11, T12, ST1, ST2 and ST3. The source electrode and the grid electrode of the T1 are connected with an upper-stage driving signal; the drain electrode of the T1 is connected with the source electrode of the T4; the grid electrode of the T4is connected with a latter four-stage driving signal; the drain electrode of the T1 is further connected with the grid electrode of the T3 and the grid electrode of the T5; the source electrode of the T3 is connected with the drain electrode of the T2 through the first capacitor; the source electrode of the T3 is further connected with the drain electrodes of the T6, T8, T9 and T12; the drain electrode of the T5 is connected with a current-stage scanning signal, and the source electrode of the T5 is connected with a first clock signal; the grid electrode of the T5 is further connected with the drain electrode of the T5 through a second capacitor, and the source electrode of the T6 is connected with the drain electrode of the T5. According to the technical scheme, the four clock signals can be received and correspond to the four output signals at the same time, that is, the driving signals of the current stage, the later stage, the later second stage and the later third stage are output, the number of TFTs is reduced in architecture, finally, the needed circuit board area is reduced, and therefore panel frame occupation is reduced.

Description

technical field [0001] The invention relates to panel driving technology, in particular to the design of a new driving circuit capable of reducing the border. Background technique [0002] GIP technology (Gate Driver In Panel): array gate drive technology, widely used in liquid crystal display panels (LCD) and AMOLED display panels. GOA technology is to manufacture the driving circuit of the horizontal scanning line on the substrate around the display area (ActiveArea), so that it can replace the external integrated circuit board (Integrated Circuit, IC) to complete the driving of the horizontal scanning line. GIP technology can reduce external The welding (bonding) process of the IC reduces the production cost. At present, the panel design mostly adopts bilateral GIP drive to achieve narrow frame, but the traditional GIP circuit structure is complex and almost all single-stage G_out output, and as the frame gets smaller The closer the distance between the sealant and the a...

AI Technical Summary

Problems solved by technology

[0004] For this reason, it is necessary to provide a new panel drive circuit circuit to solve the problem of excessive occupied area of ​​the prior art

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