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Device structure and device layout

A device structure and device technology, which is applied in the field of device structure and device layout, can solve the problems of reduced board area, limited reduced area, and limited space, so as to increase battery capacity, reduce the length of wiring, and reduce impedance. Effect

Pending Publication Date: 2018-07-24
BLACKSHARK TECH NANCHANG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] On the one hand, the device pitch is reduced to occupy the area of ​​the board, but the devices are also miniaturized, resulting in limited area reduction
For example, 4×4 devices can be placed in a space of 24mm×24mm, but now due to the reduced area occupied by the devices, 6×6 devices can be placed in the same area, and the layout density of the devices is changed from the original 16 / 24 / 24=0.0278 pieces / mm 2 Increased to 36 / 24 / 24=0.06 pieces / mm 2 , the layout density has been increased by 115%, and the room for improvement is limited

Method used

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  • Device structure and device layout
  • Device structure and device layout

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0050] Such as figure 2 As shown, the device layout structure of the present invention includes two bottom devices 6 and two top devices 8 (the bottom device 6 and the top device 8 are chip devices). Two bottom-layer devices 6 are vertically spaced on the printed circuit board 1, and bottom-layer device soldering terminals 7 are respectively provided at both ends of the bottom-layer device 6; There are top device soldering terminals 9 . The top-layer device welding terminals 9 at both ends of a single top-layer device 8 are respectively welded to the bottom-layer device welding terminals 7 on the same side of the two bottom-layer devices 6 to form a superimposed form.

[0051] Wherein, the distance between the two bottom devices 6 in the longitudinal direction is ≥0.15 mm. The length in the longitudinal direction of the contact surface between the soldering end 9 of the top layer device and the soldering end 7 of the bottom layer device is greater than or equal to 0.2 mm. ...

Embodiment 2

[0053] Such as image 3 , Figure 4 As shown, the device layout structure of the present invention includes a bottom device unit 2 (a QFN device is used in this embodiment), the bottom of the bottom device unit 2 is provided with a bottom solder terminal 10 of the bottom device, and a bottom solder 13 is printed on the printed circuit board 1 , the bottom device unit 2 (a QFN device is used in this embodiment) is pasted on the printed circuit board 1 by soldering the bottom pad 10 of the bottom device and the bottom solder 13 .

[0054] On the opposite side of the bottom device unit 2 (using a QFN device in this embodiment) and the top device unit 3 (using a BGA device in this embodiment), that is, on the top of the bottom device unit 2 (using a QFN device in this embodiment) And the bottom of top layer device unit 3 (adopting BGA device in the present embodiment) is respectively provided with bottom device top welding terminal 11 and top layer device bottom welding terminal 12...

Embodiment 3

[0056] Such as Figure 5 , Figure 6 As shown, the device layout structure of the present invention comprises a bottom device unit 2 (in this embodiment, a BGA device is used), and the bottom of the bottom device unit 2 is provided with a bottom solder terminal 10 of the bottom device (in this embodiment, a BGA solder ball). Printed circuit board 1 is printed with bottom solder 13, bottom device unit 2 (adopts BGA device in this embodiment) through the soldering of bottom solder 10 (in this embodiment is BGA solder ball) and bottom solder 13 of bottom device unit 2, patch on the printed circuit board 1.

[0057] On the opposite side of the bottom device unit 2 (in this embodiment, a BGA device is used) and the top layer device unit 3 (in this embodiment, a QFN device is used), that is, on the top of the bottom device unit 2 (in this embodiment, a BGA device is used) And the bottom of top layer device unit 3 (adopting QFN device in this embodiment) is respectively provided wi...

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Abstract

The invention provides a device structure comprising a bottom device unit which is welded on a printed circuit board; and a top device unit which is welded on the bottom device unit. According to thedevice structure and the device layout, the layout density is increased to reduce the board occupation area of the devices in the limited space by fully utilizing the space limit of height so that thebattery capacity can be increased and the board wiring and board occupation space can be reduced, the wiring length can be effectively reduced, the impedance can be reduced and the competiveness of the product can be enhanced.

Description

technical field [0001] The invention relates to the field of printed circuit boards, in particular to the field of surface mounting (SMT) and device packaging, in particular to a device structure and device layout. Background technique [0002] The layout density of devices is getting denser, how to arrange as many devices as possible in a smaller board space to meet the hardware design requirements. [0003] On the one hand, the device pitch is reduced to occupy the area of ​​the board, but the devices are also miniaturized, resulting in a limited area for reduction. For example, 4×4 devices can be placed in a space of 24mm×24mm, but now due to the reduction in the area occupied by the devices, 6×6 devices can be placed in the same area, and the layout density of the devices is changed from the original 16 / 24 / 24=0.0278 pieces / mm 2 Increased to 36 / 24 / 24=0.06 pieces / mm 2 , the layout density has been increased by 115%, and the room for improvement is limited. [0004] On t...

Claims

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Application Information

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IPC IPC(8): H05K1/18H05K7/02
CPCH05K1/181H05K7/023H05K2201/10515
Inventor 庞峰
Owner BLACKSHARK TECH NANCHANG CO LTD
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