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A method for copper plating in a hole of a pcb board

A technology of PCB board and copper plating, which is applied to the formation of printed circuit, electrical components, and electrical connection of printed components. It can solve the problems of hole foaming and damage, and achieve the goals of solving foaming, improving temperature resistance, and improving mechanical properties. Effect

Active Publication Date: 2021-04-06
东莞市科佳电路有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the shortcomings and deficiencies in the prior art, the purpose of the present invention is to provide a method for copper plating in PCB holes, which can solve abnormal problems such as blistering and damage at the bottom of the holes.

Method used

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  • A method for copper plating in a hole of a pcb board
  • A method for copper plating in a hole of a pcb board
  • A method for copper plating in a hole of a pcb board

Examples

Experimental program
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Effect test

Embodiment 1

[0028]A method of copper plating in a PCB plate, including the following steps:

[0029](1) Drilling: Select the substrate according to the design specifications and drilling; (2) polishing; (3) blasting (4) Young mill; (5) delay; (6) Bronze: Place the substrate in Shen Copper treatment in copper water, the copper rate of 50u * # *, the copper water water2+NaOH, HCHO, EDTA concentration was 2 g / l, 8 g / l, 3.3 g / l and 35 g / l, (7) drying; (8) VCP electroplating copper.

[0030]Among them, the specific operation of the step (2) polishing is: polishing the substrate using a nonwoven fabric of 1400 #, the polishing speed is 1.5 m / min.

[0031]Among them, the specific operation of the step (4) seed mill is: a high pressure water stream is frozen, and the water pressure is 11 kg / cm.2The rinsing speed is 2 m / min.

[0032]Among them, the step (5) manda is 75 ° C, and the removal rate is controlled at 0.4 mg / cm.2.

[0033]Among them, the number of times in the step (5) is 2 times, and the fir...

Embodiment 2

[0036]A method of copper plating in a PCB plate, including the following steps:

[0037](1) Drilling: Select the substrate according to the design specifications and drilling; (2) polishing; (3) blasting (4) Young mill; (5) delay; (6) Bronze: Place the substrate in Shen Bronze water is carried out in copper water, the brass rate is 40u * # *, the copper water2+NaOH, HCHO, EDTA concentration is 1.7 g / l, 6 g / l, 1.9 g / l and 27 g / l, 1.9 g / l and 27 g / l; (7) drying; (8) VCP electroplating copper.

[0038]Among them, the specific operation of the step (2) polishing is: polishing the substrate using a nonwoven fabric of 1300 #, the polishing speed is 1 m / min.

[0039]Among them, the specific operation of the step (4) of the young mill is: the substrate is frozen, the water pressure is 9kg / cm by high pressure water flow.2The rinsing speed is 2 m / min.

[0040]Among them, the step (5) in the mixed operating temperature is 70 ° C, the removal rate is controlled at 0.3 mg / cm2.

[0041]Among...

Embodiment 3

[0044]A method of copper plating in a PCB plate, including the following steps:

[0045](1) Drilling: Select the substrate according to the design specifications and drilling; (2) polishing; (3) blasting (4) Young mill; (5) delay; (6) Bronze: Place the substrate in Shen Copper treatment in copper water, the copper rate is 60u * # *, the copper water2+NaOH, HCHO, EDTA concentration was 2.3 g / l, 10 g / l, 4.6 g / l and 43 g / l, 4.6 g / l and 43 g / l; (7) drying; (8) VCP electroplating copper.

[0046]Among them, the specific operation of the step (2) polishing is: polishing the substrate with a nonwoven fabric of 1500 #, the polishing speed is 2 m / min.

[0047]Among them, the specific operation of the step (4) seed mill is: brushing the substrate using a high pressure water flow, water pressure is 13 kg / cm.2The rinsing speed is 2 m / min.

[0048]Among them, the step (5) manda is 80 ° C, and the rate is controlled at 0.6 mg / cm.2.

[0049]Among them, the number of times in the step (5) is 2...

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Abstract

The present invention relates to the technical field of PCB processing technology, in particular to a method for copper plating in a hole of a PCB, comprising the following steps: (1) drilling: selecting a substrate according to design specifications and performing drilling; (2) polishing; (3) ) sandblasting (4) fine grinding; (5) glue removal; (6) copper sinking: the substrate is placed in the copper sinking potion for copper sinking treatment, the copper sinking rate is 40‑60U", the Cu of the copper sinking potion 2+ , NaOH, HCHO, and EDTA concentrations are 1.7-2.3g / L, 6-10g / L, 1.9-4.6g / L and 27-43g / L in turn; (7) drying; (8) VCP copper plating. The invention effectively solves the abnormal problems such as foaming and damage at the bottom of the hole after optimizing the copper deposition rate and the concentration of the potion components in the copper deposition process, the effect is remarkable, and the method is easy to be industrialized.

Description

Technical field[0001]The present invention relates to the field of PCB processing process, and more particularly to a method of copper plating in a PCB plate.Background technique[0002]The PCB (Printed Circuit Board), the Chinese name is a printed circuit board, also known as the printed circuit board, is an important electronic component, is a support of the electronic component, and is an electrical connection of electronic components. Since it is made of electronic printing, it is called a "print" circuit board.[0003]Among them, the bronze is a referred to as the Eletcroles Plating Copper, also known as plated through holes, is a PTH, which is a catalytic redox reaction. The two or multi-layer plates are required to perform PTH processes after the drilling is completed. In the brass process, it is prone to abnormal phenomena such as foaming, damage to the bottom of the hole.Inventive content[0004]In order to overcome the disadvantages and insufficient shortcomings in the prior art...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/42
CPCH05K3/423H05K2203/072
Inventor 陈军民王海平丁伟岳绍群陆光谋
Owner 东莞市科佳电路有限公司