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Housing assembly, method of making, and electronic device

A shell component and shell technology, applied in the electronic field, can solve the problems of low service life of shell components, heavy shell quality, insufficient impact resistance, etc.

Active Publication Date: 2022-08-02
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the shell made of ceramic material is heavy, which is not conducive to reducing the mass of the electronic device, and the shell assembly formed of ceramic material is relatively brittle and has insufficient impact resistance, resulting in a low service life of the shell assembly

Method used

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  • Housing assembly, method of making, and electronic device
  • Housing assembly, method of making, and electronic device
  • Housing assembly, method of making, and electronic device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0059] Example 1 Preparation of housing assembly

[0060] Preparation of ceramic matrix: a dry pressing method is adopted, and the thickness is reduced by debinding and sintering, CNC processing and flat grinding to obtain a ceramic matrix with a bottom surface and 4 side walls and a thickness of 0.25 mm.

[0061] Preparation of buffer layer: 0.30mm glass fiber is placed in epoxy phenolic resin glue and soaked, the heating temperature is 150 degrees Celsius, the epoxy phenolic resin is melted, soaked for 10 minutes, and then the double-sided silicone oil film is placed in the roller press. Press to remove excess resin, cool until the resin is solidified, and cut according to the size of the ceramic back cover, leaving a margin of 15mm on one side.

[0062] Hot-pressing molding: Set a silicone sleeve on the mold on the side where the copying mold is in contact with the buffer layer, the Shore hardness of the silicone is 70HSD, and spray epoxy phenolic resin and curing agent (do...

Embodiment 2

[0064] Example 2 Preparation of housing assembly

[0065] The rest of the operations are the same as in Example 1, except that the two profiling molds (one side of the male mold and one side of the female mold) are covered with silicone sleeves.

Embodiment 3

[0066] Example 3 Preparation of housing assembly

[0067] The rest of the operations are the same as in Example 1, except that the Shore hardness of the silica gel is 80HSD.

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Abstract

The present application provides housing assemblies, methods of making, and electronic devices. The method includes: preparing a ceramic substrate, the ceramic substrate having a bottom and sidewalls connected to the bottom; providing a buffer layer, the size of the buffer layer being consistent with the ceramic substrate; combining the buffer layer and the The ceramic substrate is placed in a profiling mold for hot pressing to obtain the shell assembly. The shell assembly obtained by the method has the appearance of ceramic texture, the total mass of the shell assembly is small, the impact resistance of the shell assembly is good, and the shell assembly obtained by the method can have a good appearance without serious deformation and distortion due to stress relief.

Description

technical field [0001] The present application relates to the field of electronic technology, and in particular, to a housing assembly, a preparation method and an electronic device. Background technique [0002] With the development of materials and electronic technology, users' requirements for the appearance of electronic equipment also increase. Moreover, due to the needs of 5G communication, housings made of non-conductive materials are more and more widely used in various electronic devices. Ceramic materials are gradually used in the housing of electronic devices due to their good appearance and texture, as well as their non-conductive properties that can meet the needs of 5G communication. However, the housing made of ceramic material is heavier, which is not conducive to reducing the mass of the middle body of the electronic device, and the housing component formed of ceramic material is brittle and has insufficient impact resistance, resulting in a low service lif...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B9/00B32B9/04B32B17/02B32B33/00B32B37/06B32B37/10B32B38/00H05K5/00B28B3/00
CPCB32B9/005B32B9/047B32B5/02B32B33/00B32B37/06B32B37/10B32B38/0004H05K5/00B28B3/00B32B2038/0076B32B2260/021B32B2260/046B32B2262/101B32B2457/00B32B2307/718
Inventor 晏刚杨光明侯体波
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD