Intelligent perforating method for laser cutting and laser cutting device

Abstract

The invention discloses an intelligent perforating method for laser cutting and a laser cutting device. The method includes the steps of receiving interface parameters input by a user, obtaining position information of a cutting head unit, driving the cutting head unit to move to a to-be-perforated position, performing logical operation on the interface parameters according to a first preset logical rule to obtain perforating parameters of primary perforating, making a driving unit to perform driving operation according to the perforating parameters, obtaining perforating parameters of next perforating according to the perforating parameters of last perforating and a second preset logical rule, judging whether the perforating parameters of next perforating meet ending conditions, and if yes, ending the process, otherwise making the driving unit to perform driving operation according to the perforating parameters until the obtained perforating parameters meet the ending conditions. By means of the method, the interface setting time of an operator can be shortened, meanwhile perforating efficiency is improved, and machining stability is improved.

Description

technical field [0001] The invention relates to the technical field of laser cutting, in particular to an intelligent perforation method for laser cutting and laser cutting equipment. Background technique [0002] During the cutting process of laser equipment, each graphic element must be perforated before cutting, and the perforation time takes up a large part of the entire cutting process. With the increasing demand for high-power thick plate processing, there are more requirements and optimizations for the performance and efficiency of piercing. At the same time, the perforation factor has a great influence on the cutting effect, and even directly determines whether the cutting workpiece can be qualified. [0003] At present, the perforation process commonly used in the market includes direct perforation for thin plates; segmental perforation and progressive perforation for medium and thick plates; and three-stage perforation for thick plates. Although these processes c...

AI Technical Summary

Problems solved by technology

Although these processes can meet certain processing requirements, there are many parameters to be set on the operation interface, and there are also many data to be set. The skill level and proficiency of the debugger will affect the final use effect and stability.

As the laser processing power increases, the cutting material becomes thicker, and the debugging process becomes more and more complicated, requiring debugging personnel to have higher professional ability

In specific applications, the commissioning of the existing perforation process takes a long time and requires high costs

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