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High-temperature-resistant graphene heating plate

A graphene and heating plate technology, which is applied in ohmic resistance heating, heating element materials, electric heating devices, etc., can solve the problems of glue melting, unstable working state of graphene heating plate, easy explosion of graphene heating plate, etc., to achieve The effect of stable structure, tight combination, and not easy to burst

Pending Publication Date: 2020-02-14
王成斌 +2
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, there is a serious problem in the graphene heating plate produced by this process. The heating temperature of the graphene heating plate can only be heated to 230-300 degrees. After exceeding this temperature, the working state of the graphene heating plate is very unstable, and the glue will In a molten state, the graphene heating plate is easy to explode

Method used

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Embodiment Construction

[0023] This part will describe the specific embodiment of the present invention in detail, and the preferred embodiment of the present invention is shown in the accompanying drawings. Each technical feature and overall technical solution of the invention, but it should not be understood as a limitation on the protection scope of the present invention.

[0024] In the description of the present invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc. indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, and are only In order to facilitate the description of the present invention and simplify the description, it does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.

[0025] I...

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Abstract

The invention discloses a high-temperature-resistant graphene heating plate, which comprises a microcrystalline glass plate, a flaky graphene sintering layer and conductive parts. The flaky graphene sintering layer formed by sintering a flaky graphene mixture is integrally arranged on one side of the microcrystalline glass plate. The two groups of conductive parts which are not in contact with each other are arranged on the surface of the flaky graphene sintering layer. Because the flaky graphene sintering layer fixed on one side of the microcrystalline glass plate after sintering has a stablephysical structure, the structure is very stable, the combination with the microcrystalline glass plate is tighter, and the graphene heating plate is not easy to burst at high temperature. Glue is not used for bonding, and the problem of glue melting at high temperature is avoided. Tests prove that the heating temperature of the graphene heating plate produced by the method can be up to 550-600 DEG C. Compared with the prior art, the heating temperature of the graphene heating plate is greatly improved.

Description

technical field [0001] The invention relates to the field of heating plates, in particular to a high temperature resistant graphene heating plate. Background technique [0002] The heating plate is a heating method commonly used to heat objects, and graphene is a new heating carrier. It can generate high temperature by energizing the sheet-shaped graphene plate, but due to the cost of the complete sheet-shaped graphene Higher, the manufacturing process adopted by the existing graphene heating plate is to mix the flake graphene powder with a specific glue, and then coat it on a glass-ceramic plate and harden it to make it. However, there is a serious problem in the graphene heating plate produced by this process. The heating temperature of the graphene heating plate can only be heated to 230-300 degrees. After exceeding this temperature, the working state of the graphene heating plate is very unstable, and the glue will In a molten state, the graphene heating plate is easy t...

Claims

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Application Information

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IPC IPC(8): H05B3/14
CPCH05B3/145
Inventor 王成斌莫奕田简炳根
Owner 王成斌
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