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Systems and methods for forming adhesive bonds

A technology of adhesives and hot-melt adhesives, applied in adhesive heating bonding methods, chemical instruments and methods, film/sheet adhesives, etc., can solve the problem of lack of air permeability and excessive rigidity , performance problems and other problems, to achieve the effect of reducing the amount of adhesive, reducing waste and improving air permeability

Inactive Publication Date: 2020-02-14
BEMIS ASSOCS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, in some applications, bonds formed with HMA may be too rigid and / or lack breathability
Such bonds can cause performance issues in apparel materials and other applications that require soft, strong and breathable bonded areas

Method used

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  • Systems and methods for forming adhesive bonds
  • Systems and methods for forming adhesive bonds
  • Systems and methods for forming adhesive bonds

Examples

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Embodiment Construction

[0027] It is contemplated that the devices, systems, methods and processes of the claimed invention include variations and adaptations developed using information from the examples described herein. Adaptations and / or modifications of the devices, systems, methods, and processes described herein can be performed by one of ordinary skill in the relevant art.

[0028] It should be understood that the order of steps, or order for performing certain actions, is immaterial so long as the invention remains operable. Also, two or more steps or actions may be performed simultaneously.

[0029] refer to figure 1 , in some examples, printing process 10 is used to print the hot melt adhesive onto release paper 12 . A nozzle or other adhesive delivery device 14 feeds adhesive 16 into a tank 18, which is preferably heated to maintain the adhesive 16 above its melting temperature and in a liquid state. Grooves 18 are positioned against an engraved or gravure roll 20 that includes a patte...

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Abstract

A printing process is used to print a pattern of hot melt adhesive onto a release paper. The adhesive pattern can be transferred from the release paper and used to bond two substrates together. The adhesive pattern preferably includes a repeating pattern of discrete features, with each feature having a minimum dimension in a range up to 10 mm. In preferred embodiments the hot melt adhesive comprises at least one of a thermoplastic polyurethane, a co-polyester, a polyolefin, a thermoplastic rubber, and a polyamide. The pattern of hot melt adhesive is used for bonding garment layers.

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit of U.S. Provisional Application No. 62 / 511,536, filed May 26, 2017, which is hereby incorporated by reference in its entirety. technical field [0003] In various embodiments, the present invention relates to adhesive materials, and more particularly to systems and methods for printing and using adhesive patterns. Background technique [0004] Hot melt adhesives (HMA) such as thermoplastic polyurethane (TPU) are commonly used to form bonds between two or more substrates such as fabrics, foams, plastics and other composite materials and compositions. HMA can exhibit high tensile strength, excellent flexibility, and good abrasion resistance. HMA films are available in a variety of manufacturing methods from hot melt to flame lamination. These membranes can be activated using various welding operations including ultrasonic, HF, RF and platen sealing. [0005] However, in some applica...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/10C09J5/06A41D27/00
CPCA41D27/00A41D31/102A41D31/145C09J5/06C09J2400/263C09J2421/00C09J2423/00C09J2467/00C09J2475/00C09J2477/00C09J7/10C09J2301/204A41H43/04B29C65/4815B29C65/526B32B7/14B32B37/1292B32B2262/0276B32B2262/062B32B2437/00B41M3/006C09J7/21D06M17/08
Inventor 史蒂芬·托佩尔达里尔·强生贾里德·艾德
Owner BEMIS ASSOCS