Self-cooled modular radiator

Abstract

The invention discloses a self-cooled modular radiator, and belongs to the technical field of heat dissipation of industrial automation products and communication products. The self-cooled modular radiator comprises a heat transfer substrate (1), a phase-change energy storage module (2) and cooling fins (3). Regular cavities are machined in the surface of the heat transfer substrate (1), the phasechange energy storage modules (2) with the same cavity shape are installed in the cavities of the heat transfer substrate (1) after heat conduction glue is smeared in the cavities, and the cooling fins (3) are connected with the heat transfer substrate (1) and the phase change energy storage modules (2) through screws. The problems that the weight is increased, the structure is complex, machiningand assembling are difficult, and the production cost is increased due to the fact that the heat dissipation area is simply increased when the heat dissipation performance of an existing self-coolingradiator is improved are solved. The LED lamp has the advantages that the heat dissipation performance can be improved. The production and machining are facilitated. The product cost can be reduced,and the installation is convenient.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation of industrial automation products and communication products, and in particular provides a self-cooling modular radiator, which is suitable for various industrial automation and communication products requiring self-cooling heat dissipation. Background technique [0002] With the development and application of artificial intelligence and 5G communication technology, more and more industrial automation and communication products have been applied. These products have higher and higher performance requirements for power devices such as chips, and the power consumption and temperature rise of power devices also increase accordingly. Excessive temperature will cause product failure, for example, the life of the chip will be halved every time the chip rises by 10°C. Therefore, higher requirements are put forward for the heat dissipation performance of the product, and simply increasing the he...

AI Technical Summary

Problems solved by technology

By using phase change materials, designing independent phase change energy storage modules, designing independent heat transfer substrates and heat sinks, and using embedded or overlapping methods when combining phase change energy storage modules, heat transfer substrates and heat sinks into radiators Effective innovations such as multi-type combination mode; solve the problems of existing self-cooling radiators such as increased weight, complex structure, difficulties in processing and assembly, and increased production costs caused by simply increasing the heat dissipation area when improving heat dissipation performance

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