Cladding structure for enhancing corrosion resisting performance of mobile phone inserting connection piece
A connector and corrosion-resistant technology, which is applied in the field of coating structure that enhances the corrosion resistance of mobile phone connectors, can solve problems such as short service life, less plug-in and pull-out resistance of the coating, and strict environmental protection requirements, so as to improve corrosion resistance And wear resistance, avoid skin allergies, enhance the effect of corrosion resistance
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Embodiment 1
[0014] Such as figure 1 As mentioned above, a coating structure for enhancing the corrosion resistance of a mobile phone connector, the connector includes a functional area part, and the coatings of the functional area part are copper coating 1, first silver coating 2, first Nickel-tungsten coating 3, the first gold coating 4, the second nickel-tungsten coating 5, the second gold coating 6, the second silver coating 7, rhodium alloy coating 8, wherein the copper coating 1 is plated on the part of the functional area on substrate 9.
[0015] The substrate 9 of the functional area part is a copper substrate.
[0016] The thickness of the copper coating 1 is 1 μm, the thickness of the first silver coating 2 is 3 μm, the thickness of the first nickel-tungsten coating 3 is 1.25 μm, the thickness of the first gold coating 4 is 0.04 μm, and the thickness of the second nickel-tungsten coating 5 The thickness is 1.25 μm, the thickness of the second gold plating layer 6 is 0.04 μm, th...
Embodiment 2
[0019] A coating structure for enhancing the corrosion resistance of a mobile phone connector, the connector includes a functional area, and the coatings of the functional area are copper coating 1, first silver coating 2, and first nickel-tungsten coating from bottom to top 3. The first gold coating 4, the second nickel-tungsten coating 5, the second gold coating 6, the second silver coating 7, and the rhodium alloy coating 8, wherein the copper coating 1 is plated on the substrate 9 of the functional area part superior.
[0020] The substrate 9 of the functional area part is a copper substrate.
[0021] The thickness of the copper coating 1 is 0.5 μm, the thickness of the first silver coating 2 is 2.5 μm, the thickness of the first nickel-tungsten coating 3 is 0.75 μm, the thickness of the first gold coating 4 is 0.06 μm, the second nickel-tungsten coating 5 has a thickness of 0.75 μm, the second gold plating layer 6 has a thickness of 0.03 μm, the second silver plating lay...
Embodiment 3
[0024] A coating structure for enhancing the corrosion resistance of a mobile phone connector, the connector includes a functional area, and the coatings of the functional area are copper coating 1, first silver coating 2, and first nickel-tungsten coating from bottom to top 3. The first gold coating 4, the second nickel-tungsten coating 5, the second gold coating 6, the second silver coating 7, and the rhodium alloy coating 8, wherein the copper coating 1 is plated on the substrate 9 of the functional area part superior.
[0025] The substrate 9 of the functional area part is a copper substrate.
[0026] The thickness of the copper coating 1 is 0.5 μm, the thickness of the first silver coating 2 is 1.25 μm, the thickness of the first nickel-tungsten coating 3 is 0.4 μm, the thickness of the first gold coating 4 is 0.04 μm, the second nickel-tungsten coating 5 has a thickness of 0.5 μm, the second gold plating layer 6 has a thickness of 0.04 μm, the second silver plating laye...
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