A technological process of intelligent flexible display general assembly
A flexible display and process technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of complex processing technology, flexible surface bending, reducing the quality of finished products, etc., to achieve simple processing technology, avoid bending, and improve the quality of finished products. Effect
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Embodiment 1
[0022] The technical process of the general assembly of an intelligent flexible display screen provided by this embodiment specifically includes the following steps:
[0023] S1. Cut according to a preset size to form two flexible substrates;
[0024] S2, then milling one of the cut flexible substrates to form a placement bin;
[0025] S3. Perform deburring treatment on the two flexible substrates, and perform surface smoothing treatment;
[0026] S4. Set an intelligent display chip in the placement bin, and then apply a layer of adhesive around it;
[0027] S5. Test the surface flatness of the flexible thin film crystal layer first, match the flexible thin film crystal layer whose surface flatness meets the requirements with the adhesive, and then cover it with a film encapsulation layer;
[0028] S6, using the flexible substrate equipped with the flexible thin film crystal layer as the bottom plate, positioning the bottom surface flatness of the bottom plate, and dispensin...
Embodiment 2
[0033] The technical process of the general assembly of an intelligent flexible display screen provided by this embodiment specifically includes the following steps:
[0034] S1. Cut according to a preset size to form two flexible substrates;
[0035] S2, then milling one of the cut flexible substrates to form a placement bin;
[0036] S3. Perform deburring treatment on the two flexible substrates, and perform surface smoothing treatment;
[0037] S4. Set an intelligent display chip in the placement bin, and then apply a layer of adhesive around it;
[0038] S5. Test the surface flatness of the flexible thin film crystal layer first, match the flexible thin film crystal layer whose surface flatness meets the requirements with the adhesive, and then cover it with a film encapsulation layer;
[0039] S6, using the flexible substrate equipped with the flexible thin film crystal layer as the bottom plate, positioning the bottom surface flatness of the bottom plate, and dispensin...
Embodiment 3
[0049] The technical process of the general assembly of an intelligent flexible display screen provided by this embodiment specifically includes the following steps:
[0050] S1. Cut according to a preset size to form two flexible substrates;
[0051] S2, then milling one of the cut flexible substrates to form a placement bin;
[0052] S3. Perform deburring treatment on the two flexible substrates, and perform surface smoothing treatment;
[0053] S4. Set an intelligent display chip in the placement bin, and then apply a layer of adhesive around it;
[0054] S5. Test the surface flatness of the flexible thin film crystal layer first, match the flexible thin film crystal layer whose surface flatness meets the requirements with the adhesive, and then cover it with a film encapsulation layer;
[0055] S6, using the flexible substrate equipped with the flexible thin film crystal layer as the bottom plate, positioning the bottom surface flatness of the bottom plate, and dispensin...
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