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BMS heat dissipation structure

A heat dissipation structure and MOS tube technology, applied in the field of lithium-ion batteries, can solve the problems of BMS temperature rise, accelerated sealing ring aging, unsuitable for high-power charging and discharging battery packs, etc., and achieve the effect of optimizing heat dissipation efficiency

Pending Publication Date: 2020-02-21
LINKDATA NEW ENERGY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The heat of the MOS tube located between the upper case and the BMS protection plate accumulates or conducts into the inner cavity of the BMS case, causing the temperature inside the BMS to rise; in addition, the heat dissipation efficiency is limited only through the planar lower case, and it will also accelerate Aging of the sealing ring between the upper shell and the lower shell
Therefore, the BMS with the above heat dissipation structure is not suitable for high-power charging and discharging battery packs

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0052] Such as Figure 1-4 As shown, the BMS heat dissipation structure of Embodiment 1 includes a housing 1 and a BMS protection plate 2 disposed in the housing. A MOS tube 3 is fixedly arranged on the outer edge of the BMS protection plate 2. The housing 1 includes an upper housing 11 and the lower case 12, the assembly of the BMS protection plate 2 and the MOS tube 3 and the upper case 11, and the assembly and the lower case 12 are closely fitted with a heat conduction sheet 4; The side ends are integrally connected.

[0053] In Embodiment 1, the MOS tubes 3 are all arranged above the BMS protection board.

[0054] The material of the housing 1 is aluminum. The upper housing 11 includes an open box-shaped central part 111 and a sealing edge 112 located on the outer periphery of the central part. The central part 111 is provided with a recessed part a, and the inner surface a1 of the recessed part is attached to the heat conducting sheet 4. ; The heat conduction sheet 4 is...

Embodiment 2

[0056] Such as Figure 5-8 Shown, embodiment 2 is based on embodiment 1, difference is:

[0057] The assembly is integrally connected with the same-side end of the heat conducting sheet 4 between the upper case 11 and the lower case 12 and combined into a closed loop.

[0058] The outer surface of the upper casing 11 is provided with heat dissipation fins 5 , and the heat dissipation fins 5 are arranged opposite to the joints of the heat conduction fins on the inner surface of the upper casing.

[0059] The adhesive-backed graphite sheet is directly bonded to the assembly of the BMS protection plate 2 and the MOS tube 3 .

[0060] A sealing ring 6 is arranged between the upper casing 11 and the lower casing 12; the top surface of the central part 111 of the upper casing 11 is opposite to the opening, and the inner concave surface of the recessed part a transitions from the top surface of the casing to the side of the central part 111 , the recessed part a is located between ...

Embodiment 3

[0063] Such as Figure 9 As shown, Embodiment 3 is based on Embodiment 2, and the MOS transistor 3 is separately arranged on the upper and lower sides of the BMS protection plate 2 .

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Abstract

The invention discloses a BMS heat dissipation structure which includes a casing body and a BMS protection plate arranged in the casing body. A MOS tube is fixedly arranged on the BMS protection plate. The casing body includes an upper casing body and a lower casing body. Thermally conductive sheets are in close contact between the assembly of the BMS protection plate and the MOS tube and the upper casing body, and between the assembly of the BMS protection plate and the MOS tube and the lower casing body respectively. The thermally conductive sheets are connected with the BMS heat dissipationstructure, and arranged on the assembly of the BMS protection plate and the MOS tube between the upper casing body and the lower casing body, so as to form a direct contact heat transfer structure with a large heat exchange area. Heat is adaptively distributed to the upper and lower casing bodies for heat dissipation, which optimizes heat dissipation efficiency.

Description

technical field [0001] The invention relates to the technical field of lithium ion batteries, in particular to a BMS heat dissipation structure. Background technique [0002] BMS (BATTERY MANAGEMENT SYSTEM, battery management system) is one of the key components of lithium-ion power batteries. Reminder, calculate remaining capacity, discharge power, report SOC&SOH status, and control the charger to charge with the best current according to the voltage, current and temperature of the battery, and use the CAN bus interface to communicate with the vehicle master controller, motor controller, and energy control System, on-board display system for real-time communication. With the extension of BMS operation time, the temperature of its internal components such as MOS transistors (metal-oxide semiconductor field effect transistors) will continue to rise. Excessive temperature will affect the performance of electronic devices, resulting in damage to transistors, which in turn affe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01M10/42H01M10/613H01M10/653H01M10/6551
CPCH01M10/425H01M10/613H01M10/653H01M10/6551Y02E60/10
Inventor 侯宏伟王勒言张培薛从文
Owner LINKDATA NEW ENERGY CO LTD
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