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Packaging device and packaging method for a composite phase change material

A composite phase change material and packaging device technology, which is applied in the field of composite phase change material packaging devices, can solve the problems affecting the heat storage performance of the phase change material, lack of heat absorption and heat release structures, etc., and achieves good filling effect and heat dissipation effect. Good, use flexible effects

Active Publication Date: 2022-06-21
SHAOYANG UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In order to overcome the shortcomings of the above-mentioned prior art, the purpose of the present invention is to provide a composite phase change material packaging device to solve the problem of the lack of heat absorption and heat release structures inside the existing phase change material packaging device, which affects the heat storage of phase change materials. performance technical issues

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  • Packaging device and packaging method for a composite phase change material
  • Packaging device and packaging method for a composite phase change material
  • Packaging device and packaging method for a composite phase change material

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Embodiment Construction

[0029] In order to make those skilled in the art better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only Embodiments are part of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0030] It should be noted that the terms "first", "second" and the like in the description and claims of the present invention and the above drawings are used to distinguish similar objects, and are not necessarily used to describe a specific sequence or sequence. It is to be understood that the data so used may be interchanged under appropriate ...

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Abstract

The invention discloses a packaging device and a packaging method for a composite phase change material, belonging to the technical field of phase change materials, comprising a box body and a cover plate fixedly connected to the upper part of the box body. There are partitions and side plates inside the body, and a number of through holes are evenly arranged on the surface of the partition. The partitions, through holes and side plates form a cavity with strong circulation. Above the cover and opposite to the box body There are multiple feed ports installed on both sides, the electric heating plate on the bottom and back of the box can pass to the phase change composite material through the partition inside the rectangular box, and the melted phase change composite material can pass through a cavity in the whole The internal flow of the rectangular box realizes sufficient heat exchange and effective heat dissipation. The device has the advantages of compact structure, energy saving and environmental protection, good heat dissipation effect and convenient use.

Description

technical field [0001] The invention belongs to the technical field of phase change materials, and relates to a packaging device and a packaging method for composite phase change materials. Background technique [0002] In recent years, phase change energy storage and temperature control materials have been widely used in aerospace, solar energy utilization, textiles, heating and air conditioning, building thermal insulation and many other fields. The encapsulation process of the phase change material has an important influence on the heat transfer performance and service life of the phase change material. The packaging materials are required to have strength, thermal stability, excellent heat transfer, corrosion resistance, penetration resistance and compatibility. The commonly used packaging materials are organic and inorganic. The former mostly uses melamine-urea-formaldehyde, gum, etc. The latter mostly use plastic, metal and so on. The encapsulation process includes i...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B65D81/18B65D25/04
CPCB65D81/18B65D25/04
Inventor 张俊霞王泽华
Owner SHAOYANG UNIV