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Method for preparing TFT array substrate and TFT array substrate

A technology of array substrates and substrates, which is applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve problems such as copper electrode corrosion, corrosion, and copper electrode oxidation, and achieve the effect of avoiding corrosion and improving electrical conductivity

Active Publication Date: 2020-02-28
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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Problems solved by technology

[0004] The invention provides a preparation method of a TFT array substrate and a TFT array substrate, which can avoid corrosion of copper electrodes in the stripping process, so as to solve the problem of the existing preparation method of TFT array substrates and TFT array substrates. In the manufacturing process of the electrode, the technical problem of copper electrode oxidation caused by the dry stripping process alone or the copper electrode corrosion caused by the wet stripping process alone

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  • Method for preparing TFT array substrate and TFT array substrate
  • Method for preparing TFT array substrate and TFT array substrate
  • Method for preparing TFT array substrate and TFT array substrate

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Embodiment Construction

[0030] The following descriptions of the various embodiments refer to the accompanying drawings to illustrate specific embodiments in which the invention may be practiced. The directional terms mentioned in the present invention, such as [top], [bottom], [front], [back], [left], [right], [inside], [outside], [side], etc., are only for reference The orientation of the attached schema. Therefore, the directional terms used are used to illustrate and understand the present invention, but not to limit the present invention. In the figures, structurally similar elements are denoted by the same reference numerals.

[0031] The present invention is aimed at the existing TFT array substrate preparation method and TFT array substrate. In the manufacturing process of using copper electrodes to prepare source and drain electrodes, the dry stripping process alone causes the copper electrode to oxidize or the wet stripping process alone causes the copper electrode to corrode. technical p...

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Abstract

The invention provides a method for preparing a TFT array substrate and the TFT array substrate. The method mainly include: after a copper electrode is etched to form a source- drain metal film layer,performing a subsequent stripping process in two steps: dry stripping the photoresist on the source-drain metal film layer to remove part of the photoresist; and wet stripping the remaining photoresist on the source-drain metal film layer to remove the remaining photoresist to form a source and a drain. The method avoids corrosion of the copper electrode and further improves the conductivity of the TFT array substrate.

Description

technical field [0001] The invention relates to the technical field of display driving, in particular to a method for preparing a TFT array substrate and the TFT array substrate. Background technique [0002] In the TFT-LCD (Thin Film Transistor-Liquid Crystal Display Panel) manufacturing process of the Cu process, when metal copper is used as the source and drain electrodes, the stripping technology usually adopts dry stripping or wet stripping. However, when pure dry stripping is used, not only is it easy to leave photoresist, but also because the plasma gas of dry stripping contains O, S and other elements, it is easy to cause oxidation or sulfuration of copper electrodes, and it is difficult to control the stripping end point, which in turn affects the opening of TFT transistors. State current causes its on-state current to be too small. When wet stripping is used, because the stripping solution is strongly alkaline and soaked in alkaline conditions for a long time, met...

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Application Information

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IPC IPC(8): H01L21/77H01L27/12
CPCH01L27/1248H01L27/1288H01L27/124
Inventor 柴国庆
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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