Electronic component

[0036] Exemplary embodiments of the present disclosure will now be described in detail below with reference to the accompanying drawings.

[0037] The directions will be defined to clearly describe the exemplary embodiments in the present disclosure. X, Y, and Z in the drawings respectively refer to the length direction, width direction and thickness direction of the multilayer capacitor and electronic component.

[0038] Here, the Z direction refers to the stacking direction along which the dielectric layer is stacked in this exemplary embodiment.

[0039] figure 1 Is a perspective view schematically showing a multilayer capacitor of an exemplary embodiment applied to the present disclosure, Figure 2A with Figure 2B Is shown to apply to figure 1 Plan view of the first internal electrode and the second internal electrode of the multilayer capacitor, image 3 Is along figure 1 A cross-sectional view taken on the line I-I'.

[0040] First, refer to Figure 1 to Figure 3 The structure of the multilayer capacitor applied to the electronic component according to the present exemplary embodiment is described.

[0041] Reference Figure 1 to Figure 3 , The multilayer capacitor 100 according to the present exemplary embodiment may include a body 110 and first and second external electrodes 131 and 132, the first and second external electrodes 131 and 132 are respectively disposed in the X direction of the body 110 On the opposite end surface of the X direction is the first direction of the main body 110.

[0042] The body 110 may be formed by stacking a plurality of dielectric layers 111 in the Z direction of the body 110 and then sintering the plurality of dielectric layers 111. The dielectric layers 111 adjacent to each other of the main body 110 of the capacitor may be integrated with each other so that the boundary between the dielectric layers 111 adjacent to each other is not obvious without using a scanning electron microscope (SEM).

[0043] In addition, the main body 110 may include a plurality of dielectric layers 111 and first and second internal electrodes 121 and 122. The first and second internal electrodes 121 and 122 have different polarities, alternately along the Z direction of the main body 110. The dielectric layer 111 is interposed between the first internal electrode 121 and the second internal electrode 122 at the same time.

[0044] In addition, the main body 110 may include an effective area as a part that contributes to the capacitance forming the capacitor, and covering areas 112 and 113, and the covering areas 112 and 113 are provided on the upper and lower surfaces of the effective area in the Z direction as The edge part.

[0045] The shape of the main body 110 is not particularly limited, but may be a hexahedral shape. The main body 110 may have a first surface 1 and a second surface 2, a third surface 3 and a fourth surface 4, and a fifth surface 5 and a sixth surface 6, the first surface 1 and the second surface 2 being in the Z direction of the main body 110 Opposing each other, the third surface 3 and the fourth surface 4 are connected to the first surface 1 and the second surface 2 and opposite to each other in the X direction of the main body 110, and the fifth surface 5 and the sixth surface 6 are connected to the first surface 1 and The second surface 2 is connected to the third surface 3 and the fourth surface 4 and opposes each other in the Y direction of the main body 110.

[0046] The dielectric layer 111 may include, for example, BaTiO 3 Ceramic powder such as base ceramic powder.

[0047] Barium titanate (BaTiO 3 ) Examples of ceramic powders may include (Ba 1-x Ca x )TiO 3 , Ba(Ti 1-y Ca y )O 3 , (Ba 1- x Ca x )(Ti 1-y Zr y )O 3 , Ba(Ti 1-y Zr y )O 3 Etc., in which Ca, Zr, etc. are partially soluble in BaTiO 3 Medium, but not limited to this.

[0048] In addition, in addition to ceramic powder, the dielectric layer 111 may also include ceramic additives, organic solvents, plasticizers, binders, dispersants, and the like.

[0049] The ceramic additives may include, for example, transition metal oxides or transition metal carbides, rare earth elements, magnesium (Mg), aluminum (Al), and the like.

[0050] The first internal electrode 121 and the second internal electrode 122, which are electrodes applied with different polarities, may be disposed on the dielectric layer 111 to be stacked in the Z direction of the main body 110, and may be disposed in the main body 110 along the Z direction of the main body 110. The middle electrodes are alternately arranged opposite to each other, while a dielectric layer 111 is interposed between the first internal electrode 121 and the second internal electrode 122.

[0051] At this time, the first internal electrode 121 and the second internal electrode 122 may be electrically insulated from each other by the dielectric layer 111 disposed between the first internal electrode 121 and the second internal electrode 122.

[0052] Meanwhile, the present disclosure shows and describes a structure in which the internal electrodes are stacked in the Z direction of the main body 110, but the present disclosure is not limited to this, and can also be applied to a structure in which the internal electrodes are stacked in the Y direction of the main body if necessary.

[0053] One end of each of the first internal electrode 121 and the second internal electrode 122 may be exposed through the third surface 3 and the fourth surface 4 of the body 110, respectively.

[0054] The ends of the first internal electrode 121 and the second internal electrode 122 that are alternately exposed through the third surface 3 and the fourth surface 4 of the main body 110 may be electrically connected to the main body 110, which will be described below, respectively. The first external electrode 131 and the second external electrode 132 on opposite end surfaces in the X direction.

[0055] According to the configuration as described above, when a predetermined voltage is applied to the first external electrode 131 and the second external electrode 132, electric charges may be accumulated between the first internal electrode 121 and the second internal electrode 122.

[0056] At this time, the capacitance of the multilayer capacitor 100 may be proportional to the overlapping area of ​​the first internal electrode 121 and the second internal electrode 122 overlapping each other in the Z direction of the body 110 in the effective area.

[0057] In addition, the material for forming the first internal electrode 121 and the second internal electrode 122 is not particularly limited, but may be, for example, noble metal materials such as platinum (Pt), palladium (Pd), palladium-silver (Pd-Ag) alloy, etc. ), a conductive paste formed of one or more of nickel (Ni) and copper (Cu).

[0058] At this time, the method of printing the conductive paste may be a screen printing method, a gravure printing method, etc., but is not limited thereto.

[0059] The first and second external electrodes 131 and 132 may be supplied with voltages having different polarities, and the first and second external electrodes 131 and 132 may be disposed on opposite end surfaces of the main body 110 in the X direction of the main body 110 , And may be electrically connected to the exposed ends of the first internal electrode 121 and the second internal electrode 122, respectively.

[0060] The first external electrode 131 may include a first head portion 131a and a first band portion 131b.

[0061] The first head 131a may be disposed on the third surface 3 of the main body 110, and may be in contact with the end of the first internal electrode 121 exposed to the outside through the third surface 3 of the main body 110, so as to connect the first internal electrode 121 and the first external electrode 131 are electrically connected to each other.

[0062] The first strap portion 131b may be a portion extending from the first head portion 131a to the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6 of the main body 110 to improve the fixing strength.

[0063] The second external electrode 132 may include a second head portion 132a and a second band portion 132b.

[0064] The second head 132a may be disposed on the fourth surface 4 of the main body 110, and may be in contact with the end of the second internal electrode 122 exposed to the outside through the fourth surface 4 of the main body 110, so as to be used to connect the second internal electrode 122 and the second external electrode 132 are electrically connected to each other.

[0065] The second belt portion 132b may be a portion extending from the second head portion 132a to the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6 of the main body 110 to improve the fixing strength.

[0066] At the same time, the first external electrode 131 and the second external electrode 132 may further include a plating layer (not shown).

[0067] The plating layer may include a first nickel (Ni) plating layer and a second nickel (Ni) plating layer, and a first tin (Sn) plating layer and a second tin (Sn) plating layer covering the first Ni plating layer and the second Ni plating layer, respectively.

[0068] Figure 4A with Figure 4B It is a perspective view showing a schematic structure of an electronic component according to an exemplary embodiment in the present disclosure.

[0069] Reference Figure 4A with Figure 4B The electronic component 101 according to the present exemplary embodiment may include a multilayer capacitor 100 and a first metal frame 140 and a second metal frame 150 connected to the first external electrode 131 and the second external electrode 132 of the multilayer capacitor 100, respectively.

[0070] The first metal frame 140 may include a first supporting part 141 and a first mounting part 142.

[0071] The first support part 141 may be a part perpendicular to the mounting surface, elongated in the Z direction, has a predetermined width in the Y direction, and is coupled to the first head 131a of the first external electrode 131, and can be electrically and physically connected The first head 131a connected to the first external electrode 131.

[0072] At this time, a conductive adhesive part (not shown) may be disposed between the first external electrode 131 and the first support part 141.

[0073] According to the present exemplary embodiment, the conductive adhesive part may be provided on the first head 131 a of the first external electrode 131.

[0074] Such a conductive adhesive part may be formed using high-temperature solder, conductive adhesive material, etc., but is not limited thereto.

[0075] The first mounting portion 142 may be a portion extending in the X direction as the first direction from the lower end of the first supporting portion 141 and formed as a portion that is horizontal with respect to the mounting surface, and may be used as a connection when the electronic component is mounted on the substrate Terminal.

[0076] At this time, the width of the first mounting portion 142 in the Y direction may be smaller than the width of the first head portion 131a of the first external electrode 131 in the Y direction of the main body 110 and the width of the main body 110 in the Y direction of the main body 110. The direction is a second direction perpendicular to the X direction as the first direction.

[0077] In addition, the first mounting part 142 may be provided to be separated from the lower surface of the multilayer capacitor 100 by a predetermined distance in the Z direction.

[0078] In addition, when the total height of the electronic component is t and the width of the first mounting portion 142 in the Y direction is d, 0.2=d/t may be satisfied.

[0079] Meanwhile, the width in the Y direction of the first support portion 141 or the lower portion of the first support portion 141 may be smaller than the width of the first head portion 131a of the first external electrode 131 in the Y direction and the width of the body 110 in the Y direction.

[0080] In addition, according to the present exemplary embodiment, the width of the lower portion 141b of the first support portion 141 may be smaller than the width of the upper portion 141a of the first support portion 141 in the Y direction.

[0081] To this end, the first support part 141 may have cutout parts 143 and 144 respectively formed in both side surfaces of the lower portion 141b of the first support part 141 in the Y direction.

[0082] At this time, the cutout portions 143 and 144 may be formed in a quadrangular shape. For example, when the first support portion 141 has a quadrangular shape, the portions having the quadrangular shape may be removed from both sides of the lower portion 141b of the first support portion 141 to form the cutout portion. Therefore, when viewed from the Y-Z plane, the shape of the first support part 141 may be formed into a substantially T-shape.

[0083] In addition, the cutout portions 143 and 144 may extend from the lower portion 141 b of the first support portion 141 to the first mounting portion 142.

[0084] The second metal frame 150 may include a second supporting part 151 and a second mounting part 152.

[0085] The second supporting part 151 may be a part perpendicular to the mounting surface, elongated in the Z direction, and coupled to the second head 132a of the second external electrode 132, and may be electrically and physically connected to the second external electrode 132 The second head 132a.

[0086] At this time, the conductive adhesive part may be disposed between the second external electrode 132 and the second support part 151.

[0087] According to the present exemplary embodiment, the conductive adhesive part may be provided on the second head 132 a of the second external electrode 132.

[0088] Such a conductive adhesive part may be formed using high-temperature solder, conductive adhesive material, etc., but is not limited thereto.

[0089] The second mounting portion 152 may be a portion that extends in the X direction as the first direction from the lower end of the second support portion 151 and is formed as a portion that is horizontal with respect to the mounting surface, and may be used as a part when the electronic component is mounted on the substrate. Connect the terminals.

[0090] At this time, the width of the second mounting portion 152 in the Y direction may be smaller than the width of the second head portion 132a of the second external electrode 132 in the Y direction and the width of the body 110 in the Y direction. The Y direction is the same as the first The direction of the X direction is perpendicular to the second direction.

[0091] In addition, the second mounting part 152 may be provided to be separated from the lower surface of the multilayer capacitor 100 by a predetermined distance in the Z direction.

[0092] When the total height of the electronic component is t and the width of the second mounting portion 152 in the Y direction is d, 0.2=d/t may be satisfied.

[0093] Meanwhile, the width of the second support portion 151 or the lower portion of the second support portion 151 in the Y direction may be smaller than the width of the second head portion 132a of the second external electrode 132 in the Y direction and the width of the body 110 in the Y direction.

[0094] In addition, according to the present exemplary embodiment, the width of the lower portion 151b of the second support portion 151 may be smaller than the width of the upper portion 151a of the second support portion 151 in the Y direction.

[0095] To this end, the second support portion 151 may have cutout portions 153 and 154 respectively formed in both side surfaces of the lower portion 151b of the second support portion 151 in the Y direction.

[0096] At this time, the cutout parts 153 and 154 may be formed in a quadrangular shape. For example, when the second support portion 151 has a quadrangular shape, the portion having the quadrangular shape may be removed from both sides of the lower portion 151b of the second support portion 151 to form a cutout portion. Therefore, when viewed from the Y-Z plane, the shape of the second support part 151 may be formed into a substantially T-shape.

[0097] In addition, the cutout portions 153 and 154 may extend from the lower portion 151 b of the second support portion 151 to the second mounting portion 152.

[0098] The multilayer capacitor according to the related art has a structure in which the capacitor main body and the substrate directly contact each other through solder when they are mounted on the substrate. Here, since the heat or mechanical deformation generated in the substrate is directly transferred to the multilayer capacitor, it is difficult to ensure a high level of reliability.

[0099] The electronic component according to the present exemplary embodiment may ensure the interval between the multilayer capacitor 100 and the substrate by bonding the first metal frame 140 and the second metal frame 150 to the opposite end surfaces of the multilayer capacitor 100. Therefore, when the electronic component 101 is mounted on the substrate, the stress from the substrate can be prevented from being directly transferred to the multilayer capacitor 100, so that the thermal reliability, mechanical reliability, and warpage resistance of the electronic component 101 can be improved.

[0100] In addition, since when the multilayer capacitor is mounted on the substrate, the multilayer capacitor is mounted on the substrate through the metal frame, separated from the substrate by a predetermined interval, so vibration generated in the multilayer capacitor through the piezoelectric phenomenon can be reduced, and Reduce acoustic noise.

[0101] At the same time, in the case of electronic components using a metal frame, when the position and direction of the metal frame deviate from the designed conventional position and direction when the electronic component is mounted on the substrate, the end of the mounting portion of the metal frame is adjacent to the other The land pattern contacts, which tends to cause short circuit defects between components.

[0102] In the electronic component according to the present exemplary embodiment, since the width of the mounting portion is smaller than the width of the head of the external electrode, even if the position of the metal frame is skewed when the electronic component is mounted on the substrate, the metal frame can be prevented from being damaged. The mounting portion is in contact with other adjacent land patterns, so that the occurrence of short-circuit defects between components mounted on the substrate can be prevented.

[0103] Therefore, when electronic components are mounted on the substrate, the mounting density of the electronic components can be increased.

[0104] At the same time, in the case of excessively reducing the width of the first mounting part and the second mounting part, the area of ​​the first mounting part and the second mounting part is reduced due to the decrease in the width of the first mounting part and the second mounting part, Therefore, when the electronic component is mounted on the substrate, the fixing strength of the electronic component is reduced.

[0105] In addition, since the center of gravity of the electronic component according to the present exemplary embodiment is located at the upper part of the electronic component. Therefore, when the widths of the first mounting portion and the second mounting portion are reduced, the more the width is reduced, the more the possibility of the electronic component turning over when mounted on the substrate is increased.

[0106] Therefore, when the height of the electronic component is t and the width of the mounting portion in the Y direction is d, d/t needs to be adjusted appropriately.

[0107] Figure 7 It is a graph showing the rate of mounting defects according to changes in d/t.

[0108] The mounting process defect rate was determined by using a chip mounter to mount one hundred electronic components on the substrate in the range of 0.1 to 0.9 d/t and then checking the degree of collapse of the electronic components.

[0109] Reference Figure 7 In the case where d/t is less than 0.15, because the width of the mounting part of the metal frame is too small, it can be seen that the metal frame cannot support the multilayer capacitor and extremely many mounting defects occur.

[0110] In addition, in the case where d/t is 0.2 or more, the mounting defect rate is rapidly reduced. Therefore, in the case where d/t is 0.2 or more, it can be determined that the mounting portion of the metal frame sufficiently supports the multilayer capacitor.

[0111] Figure 8 It is a graph showing the results of a shear test based on changes in d/t.

[0112] In the shear test, ten electronic components with d/t ranging from 0.1 to 0.5 were mounted on the PCB, and then a force of 10 N was applied at a rate of 1 mm/min for 10 seconds to evaluate whether the electronic components fell off.

[0113] In the case where the cut portion is formed in the metal frame, the effect of enhancing the resistance to warpage deformation even if the size is small can be obtained.

[0114] Reference Figure 8 In the area where d/t is 0.1 or less, it can be seen that since the width of the mounting portion of the metal frame is too small, as a result of the shear test, the fixing force by the solder cannot be sufficiently applied, and defects occur .

[0115] In addition, in the case where d/t is 0.15 or more, no drop of electronic components occurs. Therefore, it can be confirmed that the fixing strength is sufficiently ensured in the case where d/t is 0.15 or more.

[0116] In addition, in the case where d/t is too large, the size of the mounting part may be too large and occupy a large space, which is disadvantageous. Therefore, preferably, the range of d/t is d/t <1.0.

[0117] Therefore, it can be seen that the range of d/t that can ensure the fixing strength of the substrate while preventing mounting defects is 0.2≤d/t <1.0.

[0118] Figure 5A with Figure 5B It is a perspective view showing a schematic structure of an electronic component according to another exemplary embodiment in the present disclosure.

[0119] Here, since the structure of the multilayer capacitor and the structure of the mounting portion of the metal frame are similar to the structure of the multilayer capacitor and the structure of the mounting portion of the metal frame of the above-described exemplary embodiment, a detailed description thereof will be omitted to avoid repetitive description. The vertical part of the metal frame having a structure different from the structure of the vertical part of the metal frame of the above-described exemplary embodiment is shown, and a detailed description will be provided based on the vertical part.

[0120] Reference Figure 5A with Figure 5B In the electronic component 101' according to the present exemplary embodiment, in the Y direction, the lower and upper portions of the first support portion 141' of the first metal frame 140' may have a width larger than that of the main body 110 and the first external electrode 131 The width of the first head 131a is small.

[0121] In addition, in the Y direction, the lower and upper portions of the second support portion 151 ′ of the second metal frame 150 ′ may have a width smaller than the width of the main body 110 and the width of the second head portion 132 a of the second external electrode 132.

[0122] Therefore, the first support portion 141' and the second support portion 151' may be formed in a substantially rectangular shape, and the first metal frame 140' and the second metal frame 150' may be formed in a substantially L shape.

[0123] Figure 6A with Figure 6B It is a perspective view showing a schematic structure of an electronic component according to another exemplary embodiment in the present disclosure.

[0124] Here, since the structure of the multilayer capacitor and the structure of the mounting portion of the metal frame are similar to the structure of the multilayer capacitor and the structure of the mounting portion of the metal frame of the above exemplary embodiment, a detailed description thereof will be omitted to avoid repetitive description. The vertical part of the metal frame having a structure different from the structure of the vertical part of the metal frame of the above-described exemplary embodiment is shown, and a detailed description will be provided based on the vertical part.

[0125] Reference Figure 6A with Figure 6B In the electronic component 101" according to the present exemplary embodiment, in the Y direction, the lower portion 141b' of the first support portion 141" of the first metal frame 140" may have a width smaller than that of the upper portion 141a'.

[0126] At this time, the cutout portions 143' and 144' may be formed in opposite side surfaces in the Y direction of the lower portion 141b' of the first support portion 141", and may be formed in a triangular shape such that the lower portion of the first support portion 141" 141b' may be formed in a trapezoidal shape. For example, a triangular cut-out portion may be formed by removing two corners of the first support portion 141" having a rectangular shape.

[0127] In addition, in the Y direction, the lower portion 151b' of the second support portion 151" of the second metal frame 150" may have a width smaller than that of the upper portion 151a'.

[0128] At this time, the cutout portions 153' and 154' may be formed in opposite side surfaces in the Y direction of the lower portion 151b' of the second support portion 151", and may be formed in a triangular shape such that the lower portion of the second support portion 151" 151b' may be formed in a trapezoidal shape. For example, a triangular cut-out portion may be formed by removing two corners of the second support portion 151" having a rectangular shape.

[0129] As explained above, according to the exemplary embodiments in the present disclosure, the durability and reliability of the multilayer capacitor against vibration and deformation can be improved, and the vibration caused by the piezoelectric phenomenon in the multilayer capacitor can be reduced. Acoustic noise is reduced, and short circuit defects between components can be prevented by preventing the mounting portion of the metal frame from contacting other adjacent land patterns when the multilayer capacitor is mounted on the substrate.

[0130] According to another exemplary embodiment in the present disclosure, Picture 9 It is a perspective view schematically showing the electronic component 102, and the electronic component 102 includes a plurality of multilayer capacitors sequentially arranged in one direction as a capacitor array.

[0131] Such as Picture 9 As shown in, each of the plurality of multilayer capacitors may include a main body 110, an external electrode, and a pair of metal frames 140 and 150. The external electrodes are respectively disposed on opposite surfaces of the main body 110 in the X direction. The frames 140 and 150 are respectively connected to the external electrodes.

[0132] Each of the pair of metal frames 140 and 150 may include a support part coupled to the external electrode and a mounting part extending from the lower end of the support part in the X direction and separated from the main body 110 and the external electrode.

[0133] Here, the width of the mounting portion in the Y direction is smaller than the width of the main body 110 in the Y direction, so that the short circuit defect rate when the electronic component is mounted on the board can be reduced.

[0134] Although the exemplary embodiments have been shown and described above, it will be obvious to those skilled in the art that modifications and variations can be made without departing from the scope of the invention as defined by the appended claims.