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Liquid ejection head and process for producing liquid ejection head

A liquid ejection head, liquid technology, applied in printing, inking devices, etc., can solve the problem of reducing the positioning accuracy of adjacent chips

Active Publication Date: 2020-03-13
CANON KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the positioning accuracy of adjacent chips may be reduced

Method used

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  • Liquid ejection head and process for producing liquid ejection head
  • Liquid ejection head and process for producing liquid ejection head
  • Liquid ejection head and process for producing liquid ejection head

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] figure 1 is a perspective view showing an example of the liquid ejection head 13 in this embodiment. The base plate 1 has a liquid flow path structure for supplying liquid (for example, ink) from a tank (not shown) to the device chip 2 . Preferably, the bottom plate 1 should have high chemical and heat resistance, have insulating properties, and should have high mechanical strength. For example, base plate 1 is made of fine ceramics (such as Al 2 o 3 ) and plastics (such as phenolic resin, polycarbonate resin or polyphenylene ether resin).

[0016] with adhesive ( figure 1 not shown in ), the device chip 2 is bonded to the upper surface of the base plate 1 in a straight line. figure 1 In the illustrated example, four device chips 2 are arranged, but the number of device chips 2 is not limited to four, and the number of device chips 2 may be any number greater than one. Also, a first reference mark 7 is provided on the upper surface of the bottom plate 1 .

[0017...

Embodiment 2

[0036] In Embodiment 1, a liquid ejection head is described in which device chips are arranged in a line in the printing width direction (Y axis). In Embodiment 2, a liquid ejection head will be described in which device chips are arranged in a matrix in the printing width direction (Y axis) and the direction (X axis) orthogonal to the printing width direction. The manufacturing method is substantially the same as that of Embodiment 1, so the differences will be mainly described below.

[0037] Figure 5 is a view illustrating the device chip in this embodiment. via the binder ( Figure 5 Not shown in ) the device chips 201 to 209 are bonded on the upper surface of the base plate 1 in a matrix form. Figure 5 An example in which nine device chips are arranged on the substrate 1 is shown, but the number of device chips is not limited to nine but may be any number. Each device chip in this embodiment has a shape such that a space is formed between each device chip and each a...

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PUM

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Abstract

The invention relates to a liquid ejection head and a process for producing the liquid ejection head. The liquid ejection head comprises a base plate and at least two device chips in which ejection ports for ejecting a liquid are formed and which are disposed on the base plate. At least one first reference mark is provided on the base plate. A second reference mark is provided on each of the device chips. At least one space is formed between adjacent ones of the device chips. The second reference marks and the first reference mark present in the space are disposed on an array axis along whichthe device chips are arrayed.

Description

technical field [0001] The present disclosure relates to a liquid ejection head and a method for manufacturing the liquid ejection head. Background technique [0002] A liquid ejection device such as an inkjet printing device uses a liquid ejection head. A device chip having a plurality of ejection ports is provided in the liquid ejection head. In recent years, a liquid ejection head in which a plurality of device chips are arranged in a line to realize a wider printing width has been used. [0003] The specification of US Patent Publication No. 2011 / 0020965 (hereinafter referred to as Document 1) discloses an IC chip shape in which IC chips of a print head are arranged in a row and a layout of each IC chip and a flow path unit relative to each other. Specifically, Document 1 discloses that a plurality of IC chips 100 (the reference numerals in Document 1 are given. The same applies to the following description of Document 1) are arranged in a row without gaps therebetween...

Claims

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Application Information

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IPC IPC(8): B41J2/14
CPCB41J2/14B41J2202/19B41J2202/20B41J2/14024B41J2/14072B41J2/14201B41J2002/14491B41J2/1623B41J2/1607
Inventor 浅井和宏笹木弘司山室纯永田真吾
Owner CANON KK
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