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Detection device

A detection device and tension spring technology, applied in the direction of measuring devices, measuring electricity, measuring electrical variables, etc., can solve the problems of not being able to effectively reduce costs and simplify structures, and achieve the goal of reducing maintenance costs, reducing equipment costs, and simplifying the overall structure Effect

Active Publication Date: 2021-11-23
GLOBAL UNICHIP CORPORATION +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In this way, the industry is still unable to effectively reduce costs and simplify the structure

Method used

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Embodiment Construction

[0027] Several embodiments of the present invention will be disclosed below with the accompanying drawings. For the sake of clarity, many practical details will be described together in the following description. It should be understood, however, that these practical details should not be used to limit the invention. That is to say, in the embodiment of the present invention, these practical details are unnecessary. In addition, for the sake of simplifying the drawings, some known and conventional structures and elements will be shown in a simple and schematic manner in the drawings.

[0028] figure 1 It is a schematic diagram of a detection device 10 according to an embodiment of the present invention. figure 2 for figure 1 The bottom view of the wiring carrier 400. Such as figure 1 and figure 2 As shown, the inspection device 10 is used to inspect a semiconductor device 700 . The detection device 10 includes a circuit board 100 , a wiring carrier 400 , a plurality o...

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Abstract

A detection device includes a circuit board, a wiring carrier board and a detection unit. The wiring carrier has a conductive medium, and the conductive medium is electrically connected to the circuit board. The detection unit includes a spring, and a part of the outer surface of the spring along its length direction is fixedly connected to one side of the wiring carrier board, and is electrically connected to the conductive medium. When the detection device detects a semiconductor element, another part of the outer surface of the spring along its length direction touches at least two contacts of the semiconductor element simultaneously. Through the above structure, each spring can contact multiple contacts at the same time through its long side, without spending a lot of probes to contact each conductive contact one by one, which not only effectively reduces equipment costs and maintenance costs, but also simplifies the whole frame.

Description

technical field [0001] The invention relates to a detection device, in particular to a detection device with a spring body as a detection head. Background technique [0002] Generally speaking, after the semiconductor device (such as a semiconductor circuit chip) is manufactured, the semiconductor device (hereinafter referred to as the device under test, DUT) is electrically tested to ensure the quality of the device under test when it is shipped. During electrical testing, a plurality of probes of a test device are used to respectively touch a plurality of conductive contacts of the object under test, so as to obtain test results of the object under test through signal transmission and signal analysis. [0003] However, when testing the power supply region (Vdd) and the ground region (Vss) of the device under test, the test device needs to be equipped with a plurality of probes with the same number as the above-mentioned conductive contacts so as to electrically contact the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/26
CPCG01R31/2601
Inventor 刘昌明孙育民程志丰廖致傑
Owner GLOBAL UNICHIP CORPORATION
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