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Surface mount inductor and method of manufacturing surface mount inductor

A technology of surface mounting and manufacturing method, which is used in the manufacture of inductors/transformers/magnets, inductors, fixed inductors, etc., which can solve the problems of reduced withstand voltage, small distance, and unstable adhesion between the molded body and the shielding component. , to achieve the effect of superior adhesion

Active Publication Date: 2020-03-27
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, there are cases where the adhesiveness between the molded body and the shielding member is unstable, resulting in leakage of radiation noise; voltage drop

Method used

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  • Surface mount inductor and method of manufacturing surface mount inductor
  • Surface mount inductor and method of manufacturing surface mount inductor
  • Surface mount inductor and method of manufacturing surface mount inductor

Examples

Experimental program
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Effect test

Embodiment 1

[0049] refer to Figure 1 to Figure 4 The surface mount inductor 100 of the first embodiment will be described. figure 1 is a schematic perspective view of the surface mount inductor 100 seen from the upper surface side opposite to the mounting surface side, figure 2 This is a schematic perspective view seen from the mounting surface side. image 3 It is a schematic partial perspective plan view seen from the upper surface side illustrating the internal structure of the surface mount inductor 100 . Figure 4 Among them, ( a1 ) to ( c2 ) are schematic plan views and schematic cross-sectional views for schematically explaining the manufacturing method of the surface mount inductor 100 .

[0050] Such as Figure 1 to Figure 3 As shown, the surface mount inductor 100 has: a molded body 10, which includes a composite material containing magnetic powder, and a coil is embedded; a pair of external terminals 40, which are electrically connected to the coil respectively; and a meta...

Embodiment 2

[0063] refer to Figure 5 The surface mount inductor 110 of the second embodiment will be described. Figure 5 It is a schematic perspective view of the surface mount inductor 110 seen from the upper surface side. In the surface mount inductor 110, the upper surface portion of the metal plate 30 arranged on the upper surface of the molded body 10 does not extend to the side surface on which the external terminal 40 is arranged, and the pair of side surfaces and the upper surface on which the metal plate 30 is arranged The surface mount inductor 110 has the same configuration as the surface mount inductor 100 of the first embodiment except that the continuous molded body exposed portion 12 is formed.

[0064] In the surface mount inductor 110 , the upper surface portion of the metal plate 30 has a width narrower than the width between the side surfaces of the molded body 10 on which the external terminals are disposed. In addition, the end surface of the metal plate 30 that f...

Embodiment 3

[0066] refer to Figure 6 to Figure 8 The surface mount inductor 120 of the third embodiment will be described. Figure 6 is a schematic partial perspective view seen from the upper surface side of the surface mount inductor 120, Figure 7 is through Figure 6 A schematic sectional view of a section taken along line A-A and perpendicular to the upper surface of the molded body. Figure 8 ( a1 ) to ( c2 ) are schematic plan views and schematic cross-sectional views schematically illustrating a method of manufacturing the surface mount inductor 120 . In the surface mount inductor 120, the upper surface part and the side part of the metal plate 30 are buried in the molded body 10, and the surface of the upper surface part and the side part of the metal plate 30 is not exposed from the molded body. In addition, the surface mount inductor 120 has the same configuration as the surface mount inductor 110 of the second embodiment.

[0067] Such as Figure 6 and Figure 7 As show...

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Abstract

The invention provides a surface mount inductor and a method of manufacturing the surface mount inductor. The surface mount inductor has excellent adhesion between a molded body and a shield member. Asurface mount inductor includes a coil buried in a composite material including a magnetic powder; outer terminals connected to the coil; and a molded body having a metal surface that intersects a winding axis of the coil and including the composite material. A surface mount inductor manufacturing method includes arranging, inside a mold, a metal plate having a shape covering part of a surface ofa molded body; arranging a coil and a composite material including a magnetic powder or a preliminary molded body composed of the composite material inside the mold in which the metal plate has beenarranged; and forming a molded body in which the coil is buried and that has the metal plate arranged on part of a surface of the molded body by molding the metal plate, the composite material, and the coil inside the mold to be integrated with each other.

Description

technical field [0001] The present invention relates to surface mount inductors and methods of manufacturing the same. Background technique [0002] A shielded inductor is known that includes a molded body in which a coil is embedded, and a shield member made of a conductive material that covers the surface of the molded body (for example, refer to Patent Document 1). In shielded inductors, radiation noise from the inductor is suppressed by connecting the shield member to the ground. [0003] Patent Document 1: Specification of US Patent Application Publication No. 2017 / 0309394 [0004] In a conventional shielded inductor, the shield member is formed by covering a molded body with a built-in coil with a metal plate and caulking it. Therefore, there are cases where the adhesiveness between the molded body and the shielding member is unstable, resulting in radiation noise leakage; The voltage is reduced. Contents of the invention [0005] An object of the present inventi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01F27/36H01F27/02H01F41/00
CPCH01F27/022H01F41/005H01F27/366H01F27/361H01F27/2852H01F2017/008H01F17/04H01F27/292H01F2017/048H01F27/2885
Inventor 矶部秀幸北岛正树
Owner MURATA MFG CO LTD
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