Detection device and detection method for second bonding points

Abstract

The invention discloses a detection device and a detection method for second bonding points. The detection device for the second bonding points comprises a machine body, a transfer station fixedly installed on the machine body, a detection mechanism arranged at one side of the transfer station, and a sorting mechanism arranged on the machine body, wherein the detection mechanism comprises an installation frame fixedly connected to the machine body, an optical detection component installed on the installation frame, and an electrical performance detection device installed at one side of the transfer station. According to the detection device and the detection method for the second bonding points, optical detection and electric detection are carried out on the second bonding points of bondedchips, bonding failure points and the layering condition or the pollution condition of the bonding points are inspected, the welding firmness degrees of the second bonding points are evaluated, and the chips with unstable second bonding points are screened, so that the production cost is reduced.

Description

technical field [0001] The invention belongs to the field of bonding machine design, in particular to a second bonding point detection device and detection method. Background technique [0002] During the chip packaging process, since the chip is vulnerable to mechanical force extrusion collision and thermal effect pollution failure during packaging, packaging, transportation and handling, the gold balls, gold wires and solder joints fall off during the extrusion collision process, resulting in chip failure. Failure mode, the chip in the failure mode is likely to cause installation failure of the assembled product in the later assembly process; secondly, the first bonding point and the second bonding point are different in the bonding method, and the first bonding point is heated by ultrasonic waves. At the end of the gold wire, a spherical protrusion with a radius of 1.5 to 2 times the radius of the gold wire is fired, and then under the effect of heating heat, it forms a s...

AI Technical Summary

Problems solved by technology

[0002] During the chip packaging process, since the chip is vulnerable to mechanical force extrusion collision and thermal effect pollution failure during packaging, packaging, transportation and handling, the gold balls, gold wires and solder joints fall off during the extrusion collision process, resulting in chip failure. Failure mode, the chip in the failure mode is likely to cause installation failure of the assembled product in the later assembly process; secondly, the first bonding point and the second bonding point are different in the bonding method, and the first bonding point is heated by ultrasonic waves. At the end of the gold wire, a spherical protrusion with a radius of 1.5 to 2 times the radius of the gold wire is fired, and then under the effect of heating heat, it forms a solder joint shape with the pad, and the second bonding point is formed on the substrate by the chopper. The wedge-shaped indentation is pressed against the substrate to form a wedge-shaped bond, so the welding shape of the second bonding point is usually a crescent shape different from that of the first bonding point. Bonding points are more likely to fall off and cause chip failure

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