Detection device and detection method for second bonding points

A detection device and bonding point technology, applied in the direction of measuring devices, measuring electricity, measuring electrical variables, etc., can solve problems such as golden ball chip failure, assembly product installation failure, pollution failure, etc., and achieve the effect of reducing production costs

Inactive Publication Date: 2020-03-31
南京微毫科技有限公司
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Problems solved by technology

[0002] During the chip packaging process, since the chip is vulnerable to mechanical force extrusion collision and thermal effect pollution failure during packaging, packaging, transportation and handling, the gold balls, gold wires and solder joints fall off during the extrusion collision process, resulting in chip failure. Failure mode, the chip in the failure mode is likely to cause installation failure of the assembled product in the later assembly process; secondly, the first bonding point and the second bonding point are different in the bonding method, and the first bonding poi...

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  • Detection device and detection method for second bonding points
  • Detection device and detection method for second bonding points
  • Detection device and detection method for second bonding points

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Embodiment Construction

[0027] In the following description, numerous specific details are given in order to provide a more thorough understanding of the present invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without one or more of these details. In other examples, some technical features known in the art are not described in order to avoid confusion with the present invention.

[0028] In the production of packaged devices, through the experimental research on the first bonding point and the second bonding point, it is found that the first bonding point is heated by ultrasonic waves at the end of the gold wire to form a spherical shape with a radius of 1.5 to 2 times the radius of the gold wire. Protrusion, and then form a circular solder joint shape with the pad under the effect of heating heat, the second bonding point forms a wedge-shaped indentation on the substrate under the action of the chopper and presses the substrate to form a...

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Abstract

The invention discloses a detection device and a detection method for second bonding points. The detection device for the second bonding points comprises a machine body, a transfer station fixedly installed on the machine body, a detection mechanism arranged at one side of the transfer station, and a sorting mechanism arranged on the machine body, wherein the detection mechanism comprises an installation frame fixedly connected to the machine body, an optical detection component installed on the installation frame, and an electrical performance detection device installed at one side of the transfer station. According to the detection device and the detection method for the second bonding points, optical detection and electric detection are carried out on the second bonding points of bondedchips, bonding failure points and the layering condition or the pollution condition of the bonding points are inspected, the welding firmness degrees of the second bonding points are evaluated, and the chips with unstable second bonding points are screened, so that the production cost is reduced.

Description

technical field [0001] The invention belongs to the field of bonding machine design, in particular to a second bonding point detection device and detection method. Background technique [0002] During the chip packaging process, since the chip is vulnerable to mechanical force extrusion collision and thermal effect pollution failure during packaging, packaging, transportation and handling, the gold balls, gold wires and solder joints fall off during the extrusion collision process, resulting in chip failure. Failure mode, the chip in the failure mode is likely to cause installation failure of the assembled product in the later assembly process; secondly, the first bonding point and the second bonding point are different in the bonding method, and the first bonding point is heated by ultrasonic waves. At the end of the gold wire, a spherical protrusion with a radius of 1.5 to 2 times the radius of the gold wire is fired, and then under the effect of heating heat, it forms a s...

Claims

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Application Information

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IPC IPC(8): B07C5/344B07C5/34B07C5/02B07C5/36G01R31/28G01N23/04
CPCB07C5/02B07C5/3416B07C5/344B07C5/361B07C5/362B07C2501/0063G01N23/04G01R31/2853
Inventor 杜东良
Owner 南京微毫科技有限公司
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