Laser cutting method and laser cutting device

Abstract

The invention discloses a laser cutting method, which is applied to a cutting operation of a multilayer composite material. The laser cutting method comprises the following steps of fixedly placing acut piece on a cutting platform; controlling a laser to emit a laser beam, wherein the output power of the laser is 15-50 W, the output pulse frequency is 200-2000 kHz, and the wavelength of the laserbeam is 243-455 nm; and carrying out laser cutting along a preset cutting line of the cut piece by the laser beam, wherein the cutting speed is 100-500 mm/s. Meanwhile, the invention further discloses a laser cutting device capable of implementing the laser cutting method. According to the technical scheme, the laser cutting method is adopted, the process parameters of the laser cutting machiningare controlled, so that the temperature of the heat affected area of the cut piece along the two sides of the cutting line is not increased too much, the heat influence is small, the heat can be released in time, and the phenomenon of poor quality of the cut finished product caused by the fact that molten impurities infiltrate between the layers due to the reduced adhesion between the layers is avoided.

Description

technical field [0001] The invention relates to the technical field of laser processing, in particular to a laser cutting method and a laser cutting device. Background technique [0002] In multilayer composites, the connection adhesion between the layers decreases due to the increase in temperature. During the laser cutting process, the molten impurities will infiltrate between the layers when the connection adhesion between the layers is reduced, seriously affecting the quality of laser cutting, and even leading to the failure of laser cutting processing. [0003] In actual production, the flexible OLED (Organic Light-Emitting Diode) display panel is a multi-layer composite structure. Traditional punching and other methods can easily cause the overall warpage of the film material, and the extrusion between the layers will cause stress and damage the circuit layer. problem, resulting in an abnormal display. Therefore, laser cutting is often used for laser cutting processi...

AI Technical Summary

Problems solved by technology

[0004] During the laser cutting process, the residual heat in the laser cutting process will accumulate and cause the OLED display panel to heat up, the adhesion between layers will decrease due to the increase in temperature, and the molten impurities generated during laser cutting Under the additional action of the impact force, it penetrates greatly between the layers, resulting in "bubble"-like impurities entrained between the layers, which seriously affects the quality of the cut product

In particular, "bubble"-like impurities will affect the position of the underlying material, and the focus of the laser beam spot will shift, resulting in processing failure

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