Laser cutting method and laser cutting device

Abstract

The invention discloses a laser cutting method, which is applied to the cutting operation of multi-layer composite materials, comprising the following steps: fixing and placing the cut piece on a cutting platform; 50W, the output pulse frequency is 200-2000kHz, the wavelength of the laser beam is 243-455nm; the laser beam is laser cut along the preset cutting line of the cut piece, and the cutting speed is 100-500mm / s . At the same time, the invention also discloses a laser cutting device capable of implementing the above laser cutting method. In the technical solution of the present invention, the laser cutting method is adopted to control the parameters of the laser cutting process, so that the heat-affected areas on both sides of the cut part along the cutting line are not heated up, the heat is small, and the heat can be released in time , to avoid the phenomenon that molten impurities infiltrate between layers due to the reduction of adhesion between layers, resulting in poor quality of cut products.

Description

technical field [0001] The invention relates to the technical field of laser processing, in particular to a laser cutting method and a laser cutting device. Background technique [0002] In multilayer composites, the connection adhesion between the layers decreases due to the increase in temperature. During the laser cutting process, the molten impurities will infiltrate between the layers when the connection adhesion between the layers is reduced, seriously affecting the quality of laser cutting, and even leading to the failure of laser cutting processing. [0003] In actual production, the flexible OLED (Organic Light-Emitting Diode) display panel is a multi-layer composite structure. Traditional punching and other methods can easily cause the overall warpage of the film material, and the extrusion between the layers will cause stress and damage the circuit layer. problem, resulting in an abnormal display. Therefore, laser cutting is often used for laser cutting processi...

AI Technical Summary

Problems solved by technology

[0004] During the laser cutting process, the residual heat in the laser cutting process will accumulate and cause the OLED display panel to heat up, the adhesion between layers will decrease due to the increase in temperature, and the molten impurities generated during laser cutting Under the additional action of the impact force, it penetrates greatly between the layers, resulting in "bubble"-like impurities entrained between the layers, which seriously affects the quality of the cut product

In particular, "bubble"-like impurities will affect the position of the underlying material, and the focus of the laser beam spot will shift, resulting in processing failure

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