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Polishing apparatus

An equipment and polishing head technology, applied in grinding/polishing equipment, metal processing equipment, surface polishing machine tools, etc., can solve the problems of low polishing efficiency, low silicon wafer yield, unreasonable layout of polishing equipment, etc., to achieve polishing High efficiency, reasonable layout, and the effect of improving the yield of silicon wafers

Pending Publication Date: 2020-04-07
浙江芯晖装备技术有限公司
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AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a polishing equipment to solve the problems of unreasonable layout of polishing equipment, low polishing efficiency and low yield rate of silicon wafers in the prior art

Method used

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Embodiment Construction

[0037] In order to enable those skilled in the art to better understand the technical solution of the present invention, the technical solution of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.

[0038] In the description of the present invention, it should be noted that the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The positional relationship is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship that is usually placed when the product is used. Certain orientations, constructed and operative in certain orientations, therefore are not to be construed as limitations on the invention. In addition, the terms "first" and "second" are only used for descriptive purposes, or for distinguishing different structures or components, and should not be understood as indicating or...

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Abstract

The invention relates to the technical field of silicon wafer processing equipment, in particular to a polishing apparatus. The polishing apparatus provided by the invention comprises a workbench, a polishing disk module and a polishing head module, wherein the polishing head module comprises a polishing head and a polishing head driving device; a feeding and discharging station, a rough polishingstation, a moderate polishing station and a fine polishing station are sequentially arranged on the workbench; polishing disk devices are arranged on the rough polishing station, the moderate polishing station and the fine polishing station; and the polishing head driving device drives the polishing head to carry a silicon wafer to match the polishing disk devices on the corresponding stations. The operating mechanisms of all the processes in the polishing apparatus are reasonable in layout, can simultaneously carry out rough polishing, moderate polishing and fine polishing, and achieve highpolishing efficiency. In addition, in the whole polishing operation flow, the polishing apparatus subjects the silicon wafer by one polishing head to rough polishing, moderate polishing and fine polishing in sequence, so that the damage to the silicon wafer in a transfer process is reduced, and the yield of the silicon wafers is improved.

Description

technical field [0001] The invention relates to the technical field of silicon wafer processing equipment, in particular to a polishing equipment. Background technique [0002] The silicon wafer polishing process method includes the following steps: pre-cleaning, pasting, rough polishing, medium polishing, fine polishing, stripping, wax removal and cleaning. At present, polishing equipment for silicon wafers usually uses a polishing head to drive a ceramic disc to rotate on a grinding machine for polishing operations. The existing polishing equipment has the problems of unreasonable layout of operating mechanisms and low operating efficiency in each process. In addition, when the silicon wafer is transferred between processes, there is a risk of damage to the silicon wafer, which reduces the yield of the silicon wafer. [0003] Therefore, there is an urgent need for a polishing device to solve the above problems. Contents of the invention [0004] The object of the prese...

Claims

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Application Information

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IPC IPC(8): B24B27/00B24B29/02B24B41/06B24B41/00
CPCB24B27/0023B24B27/0069B24B27/0076B24B29/02B24B41/005B24B41/068
Inventor 杨兆明颜凯中原司
Owner 浙江芯晖装备技术有限公司
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