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Durable chip type oxygen sensor

Oxygen sensor, chip-type technology, applied in the field of durable chip-type oxygen sensor, can solve the problems of increased preparation difficulty and complex process conditions, and achieve the effects of improving production pass rate, improving flatness, and avoiding warping

Inactive Publication Date: 2020-04-10
苏州溢亮材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the Pt heater is set on the YSZ ceramic substrate, an aluminum oxide insulating layer is added between the Pt heater and the YSZ ceramic. This design effectively solves the surface insulation problem of the Pt heater. It is still necessary to configure an alumina insulating layer on the inner wall of the hole, and the process conditions are complicated, which increases the difficulty of preparation

Method used

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  • Durable chip type oxygen sensor
  • Durable chip type oxygen sensor

Examples

Experimental program
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Effect test

Embodiment 1

[0029] Example 1: A durable chip oxygen sensor, including a heater layer 1, a reference air channel layer 2, a solid electrolyte layer 3, a diffusion channel layer 4 and a sensitive electrode pin layer that are sequentially sintered from top to bottom 5. The solid electrolyte layer 3 is located in the middle layer, and the heater layer 1, the reference air channel layer 2, the diffusion channel layer 4 and the sensitive electrode pin layer 5 are symmetrically distributed with respect to the solid electrolyte layer 3;

[0030] The upper and lower sides of the solid electrolyte layer 3 are respectively provided with an outer electrode 19 and an inner electrode 18, the outer electrode 19 is connected to the outer electrode via hole 13 through the outer electrode lead 14, and the inner electrode 18 is connected through the inner electrode lead 12. connected to the inner electrode via 11, the inner electrode via 11 and the outer electrode via 13 are distributed on the end of the sol...

Embodiment 2

[0034] Example 2: A durable chip oxygen sensor, comprising a heater layer 1, a reference air channel layer 2, a solid electrolyte layer 3, a diffusion channel layer 4 and a sensitive electrode pin layer sequentially sintered from top to bottom 5. The solid electrolyte layer 3 is located in the middle layer, and the heater layer 1, the reference air channel layer 2, the diffusion channel layer 4 and the sensitive electrode pin layer 5 are symmetrically distributed with respect to the solid electrolyte layer 3;

[0035] The upper and lower sides of the solid electrolyte layer 3 are respectively provided with an outer electrode 19 and an inner electrode 18, the outer electrode 19 is connected to the outer electrode via hole 13 through the outer electrode lead 14, and the inner electrode 18 is connected through the inner electrode lead 12. connected to the inner electrode via 11, the inner electrode via 11 and the outer electrode via 13 are distributed on the end of the solid elect...

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Abstract

The invention discloses a durable chip type oxygen sensor. The gas sensor comprises a heater layer, a reference gas channel layer, a solid electrolyte layer, a diffusion channel layer and a sensitiveelectrode pin layer which are sequentially sintered from top to bottom, the solid electrolyte layer is located in a middle layer, and the heater layer, the reference gas channel layer, the diffusion channel layer and the sensitive electrode pin layer are symmetrically distributed relative to the solid electrolyte layer; an outer electrode and an inner electrode are respectively arranged on the upper side and the lower side of the solid electrolyte layer; the outer electrode is connected to the outer electrode via hole through an outer electrode lead, the inner electrode is connected to the inner electrode via hole through an inner electrode lead, and the inner electrode via hole and the outer electrode via hole are distributed in the end, away from the outer electrode and the inner electrode, of the solid electrolyte layer. The warping phenomenon of the sensor in the sintering process is avoided, and the flatness and the production percent of pass of the sensor are improved; meanwhile,the problem that an aluminum oxide insulating layer needs to be arranged on the inner wall of the Pt heater when the Pt heater passes through a hole in the YSZ symmetric layer can be avoided.

Description

technical field [0001] The invention relates to a gas sensor, in particular to a durable chip oxygen sensor. Background technique [0002] Chip oxygen sensor is a kind of ceramic device with multi-layer structure. It is generally composed of a sensitive layer, a reference air channel layer and a heating layer in order from top to bottom. The sensitive layer includes yttria-stabilized zirconia (YSZ) solid electrolyte. A ceramic substrate, a sensitive outer electrode and a reference inner electrode respectively located on the upper and lower surfaces of the YSZ sensitive substrate. There are two main types of non-sensitive layers (that is, the reference airway layer and the heating layer), one is the same YSZ ceramic as the sensitive layer, and the other is the high-temperature insulating alumina ceramic. [0003] For the full YSZ structure oxygen sensor, the Pt heater is placed between the YSZ ceramic substrates. In order to avoid the short circuit phenomenon of the YSZ cera...

Claims

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Application Information

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IPC IPC(8): G01N27/409G01N27/407
CPCG01N27/409G01N27/4073G01N27/4071G01N27/4075
Inventor 夏天占忠亮
Owner 苏州溢亮材料科技有限公司