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MEMS bridge column structure and forming method

A technology of bridge columns and film-forming methods, which is applied in the direction of microstructure technology, microstructure devices, and manufacturing microstructure devices, which can solve problems such as structural failure, fracture or curling, and achieve the effect of reducing the risk of collapse of beams and columns

Pending Publication Date: 2020-04-17
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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  • Summary
  • Abstract
  • Description
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  • Application Information

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Problems solved by technology

MEMS structures often have unsupported (or overhanging) elements, so the stresses and stress gradients in the film need to be tightly controlled, otherwise the unsupported elements will break or buckle, causing the structure to fail

Method used

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  • MEMS bridge column structure and forming method

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Embodiment Construction

[0042] MEMS bridge column structure of the present invention, as figure 1As shown, it includes the substrate structure and the upper structure above the substrate; the substrate also includes a dielectric layer, and the dielectric layer has a first window area to form a groove, and the upper structure of the MEMS bridge column structure formed with the grooves described.

[0043] The upper structure of the substrate adopts a multi-layer film composite structure, mainly including a first silicon oxide layer 1, a second silicon oxide layer 4, a third silicon oxide layer 6, an amorphous silicon layer 3, and a titanium / titanium nitride layer 2 and ONO Layer 5.

[0044] The first silicon oxide layer 1 covers the substrate surface, the dielectric layer is formed above the first silicon oxide layer 1, and the first silicon oxide layer 1 includes a second window area on the substrate surface to expose a substrate, and an electrical connection layer located in the substrate below the...

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Abstract

The invention discloses an MEMS bridge column structure and a forming method. The structure employs a multi-layer film composite structure which mainly comprises a first silicon oxide layer, a secondsilicon oxide layer, a third silicon oxide layer, an amorphous silicon layer, a titanium / titanium nitride layer, and an ONO layer. The substrate comprises an electric connection layer. According to the MEMS bridge column structure and the forming method, different mold layer structures are combined to obtain the structure application suitable for the bridge column in the MEMS product; the whole suspended MEMS structure can be effectively supported; the collapse risk of the beam column is reduced; and meanwhile, the conduction performance of the bridge column is not influenced.

Description

technical field [0001] The invention relates to the field of semiconductor device manufacturing, in particular to a bridge structure of MEMS products, which can effectively support the MEMS hollow MEMS bridge column structure, and can effectively reduce subsequent packaging abnormalities caused by bridge structure warping. [0002] The invention also relates to a method of forming said MEMS bridge column structure. Background technique [0003] Micro-Electro-Mechanical Systems (MEMS, Micro-Electro-Mechanical System), also known as micro-electro-mechanical systems, micro-systems, micro-machines, etc., refers to high-tech devices with a size of a few millimeters or less, and its internal structure is generally in the order of microns or even nanometers. level, is an independent intelligent system. It is mainly composed of three parts: sensors, actuators (actuators) and micro energy sources. MEMS involves various disciplines and engineering technologies such as physics, semic...

Claims

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Application Information

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IPC IPC(8): B81B3/00B81C1/00
CPCB81B3/0067B81C1/00142B81C1/0065B81B2203/0109
Inventor 刘善善朱黎敏
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP