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Infrared binary optical device and electromagnetic shielding mesh preparation method

A binary optics, electromagnetic shielding technology, applied in optical components, magnetic field/electric field shielding, optics, etc., can solve the problems of large edge light scattering, dust stains, large surface roughness, etc., and meet the device structure aspect ratio requirements. Large, small light scattering, simple process effect

Active Publication Date: 2020-04-17
西安应用光学研究所
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Problems solved by technology

The production process of mask lithography technology is complicated and the cost is high
Since the pattern produced by the etching method is a relief structure, the surface roughness is large and the edge light scattering is large; and the mask lithography technology is difficult to prepare devices with a large aspect ratio; in addition, the relief structure will be covered during the preparation process. There are dust stains, and it is not easy to clean

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  • Infrared binary optical device and electromagnetic shielding mesh preparation method

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Embodiment Construction

[0022] The basic principle of the preparation method of the infrared binary optical device and the electromagnetic shielding grid proposed by the present invention is to prepare a layer of high-resistance transparent conductive oxide film on the substrate, and the resistance value of the prepared film is greater than 1KΩ, and the infrared light is transparent; when the high-energy When the particle beam heats the film, the resistance of the film drops rapidly and becomes completely opaque to mid- and long-wave infrared light. In this way, the required pattern can be written on the surface of the film by using the high-energy particle beam heating technology. The place where the high-energy particle beam writes the pattern is not transparent to infrared light, and the place where the high-energy particle beam is not irradiated and heated is highly transparent to infrared light. In this way, an infrared diffraction optical element can be prepared, and the thickness of the prepare...

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Abstract

The invention provides an infrared binary optical device and an electromagnetic shielding mesh preparation method. By utilizing the phenomenon that the resistivity of a transparent conductive oxide material is different at different heating temperatures, a high-energy particle beam direct writing technology is adopted to heat a specific position of a film according to a designed pattern to preparea non-etching binary infrared diffraction optical element and an electromagnetic shielding mesh. The method has the advantages that the process is simple, etching is not needed, the cost is low, thelight scattering is small, and the device with high depth-to-width ratio requirement of the device structure is easy to prepare.

Description

technical field [0001] The invention relates to the technical field of optical grid preparation, in particular to a preparation method of an infrared optical binary optical device and an electromagnetic shielding grid. Background technique [0002] With the vigorous development of optical technology, especially the optoelectronic technology represented by optical communication, and the acceleration of the trend of optomechanical integration, people have put forward high requirements for miniaturization, arrayization and integration of components in optical systems. , traditional optical components designed based on the theory of light reflection and refraction have been difficult to meet the requirements. Optical elements based on light diffraction theory have many excellent functions in realizing light wave phase transformation that traditional optics do not have, which is conducive to promoting the miniaturization, arrayization and integration of optical systems. [0003]...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B5/18H05K9/00
CPCG02B5/1847G02B5/1857H05K9/0081
Inventor 刘永强金柯王慧娜杨崇民韩俊杨海成王颖辉董莹刘青龙刘新武
Owner 西安应用光学研究所