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Active thermal control method for power device in complex convection environment

A power device and thermal control technology, applied in heating elements, ohmic resistance heating components, etc., can solve the problem of unreliable active thermal control, and achieve the effect of reducing the probability of over-temperature, good control effect and improving thermal safety.

Active Publication Date: 2020-04-17
NANJING UNIV OF SCI & TECH
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Problems solved by technology

[0004] The purpose of the present invention is to provide an active thermal control method for power devices in complex convection environments, which solves the problem of unreliable active thermal control of existing power devices in complex convection environments due to fluctuations in environmental thermal resistance

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  • Active thermal control method for power device in complex convection environment
  • Active thermal control method for power device in complex convection environment
  • Active thermal control method for power device in complex convection environment

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Embodiment Construction

[0016] The specific embodiment of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0017] like figure 1 As shown, an active thermal control method for power devices in a complex convection environment, the method includes:

[0018] Step 1: Measure the output current of the power device, the ambient temperature, and the case temperature of the power device at the first K moments in a complex convection environment, and calculate the environmental thermal resistance at each moment of the time series in combination with the thermal model between the case and the environment. Obtain historical environmental thermal resistance series, where K≥1000. The thermal network model between the power device shell and the environment in the step 1 is as follows figure 2 As shown, it can be written as a mathematical expression as follows:

[0019]

[0020] Among them, C h is the heat capacity of the heat sink of the power...

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Abstract

The invention relates to an active thermal control method for a power device in a complex convection environment. The method comprises the steps of: measuring the environment temperatures of the firstK moments and the output current and shell temperature of the power device in the complex convection environment, and obtaining a historical environment thermal resistance sequence through combiningwith a thermal model between a shell and the environment, carrying out random simulation on the historical environment thermal resistance sequence by utilizing a Markov chain to generate an environment thermal resistance sequence at M moments in the future, calculating a power device shell temperature sequence at future M moments under different current values according to the thermal model, repeating the random simulation of the environment thermal resistance sequence and the calculation of the power device shell temperature sequence for N times to obtain the number of shell temperature over-temperature points, calculating the over-temperature probability, and selecting an appropriate current constraint according to the probability requirement, and implementing active thermal control withcurrent constraint on the power device in the convection environment. Therefore, the problem of unreliable active thermal control caused by environmental thermal resistance fluctuation of the existing power device in a complex convection environment is solved, and meanwhile, the output current of the power device is relatively smooth.

Description

technical field [0001] The invention belongs to the field of thermal control of power devices, and in particular relates to an active thermal control method for power devices in a complex convection environment. Background technique [0002] With the continuous development of power electronics technology, power devices such as IGBT and MOSFET are widely used in important fields such as renewable energy and motor drive. However, due to the continuous improvement of its power density level requirements, various failures caused by high temperature are prone to occur. Therefore, it is necessary to obtain the temperature of the power device in real time, perform thermal control and over-temperature protection on it, so as to improve the thermal safety of the device operation. [0003] When the power device continues to work at high current, its high temperature will easily cause failure; and if it works according to the specified rated current, it is too conservative and it is d...

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Application Information

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IPC IPC(8): H05B3/08
CPCH05B3/08
Inventor 姜鑫应展烽张旭东钟震祖玮
Owner NANJING UNIV OF SCI & TECH
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