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Integrally packaged radio frequency micro-system assembly

A technology of micro-systems and components, applied in the direction of electric solid-state devices, semiconductor devices, semiconductor/solid-state device components, etc., can solve the problems of large RF front-end, etc., and achieve the effect of overcoming large weight, light weight, and small volume

Active Publication Date: 2020-04-21
CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The technical problem to be solved by the present invention is: how to solve the problem of large volume of the existing radio frequency front end

Method used

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  • Integrally packaged radio frequency micro-system assembly
  • Integrally packaged radio frequency micro-system assembly
  • Integrally packaged radio frequency micro-system assembly

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Such as figure 1 , figure 2 , image 3 As shown, the integrated packaged radio frequency microsystem components include a housing 1, a plurality of metal pads 2, and a grounding pad 3; the middle of the housing 1 has a horizontal partition 11, and the two sides of the partition 11 are sealed first a cavity and a second cavity;

[0037]A plurality of control chips are fixedly installed on the top surface of the partition 11, a plurality of radio frequency chips are fixedly installed on the bottom surface of the partition 11, and a power chip and a radio frequency chip are fixedly installed on the bottom surface of the second cavity;

[0038] A plurality of metal pads 2 are fixed on the top surface of the housing 1, ground pads 3 are fixed on the bottom surface of the housing 1, and the side wall of the housing 1 has a plurality of metallized holes 12; the metal pads 2 pass through the metallized holes 12 is connected to the control chip, the metal pad is connected to...

Embodiment 2

[0046] Such as image 3 As shown, on the basis of the first embodiment above, this embodiment also includes a radio frequency signal pad 141 for connecting with the antenna unit to transmit a radio frequency signal. The radio frequency signal pad 141 is circular and welded on the second substrate 14 On the bottom surface, the ground pad 3 leaves a circular empty area, and the radio frequency signal pad 141 is welded in the circular empty area, and is arranged at intervals with the ground pad 3, the two are not in contact, and the radio frequency signal pad 141 is metallized The hole 12 is connected with the radio frequency switch chip.

[0047] The structures involved in this embodiment are: MMIC (Monolithic Microwave Integrated Circuit), chip components such as bare chips, surface mount ICs, three-dimensional multilayer substrates, metal cover plates 4, and metal heat dissipation blocks 5; The soldering packaging process involved is prepared based on MCM (Multi Chip Module) ...

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PUM

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Abstract

The invention discloses an integrally packaged radio frequency micro-system assembly which comprises a shell, a metal bonding pad and a grounding bonding pad, a partition plate is arranged in the shell, and a first sealed cavity and a second sealed cavity are formed in the two sides of the partition plate. A plurality of chips are fixedly mounted on the top surface of the partition plate, a plurality of chips are fixedly mounted on the bottom surface of the partition plate, and a plurality of chips are fixedly mounted on the bottom surface of the second cavity; a plurality of metal bonding pads are fixed on the top surface of the shell, and the grounding bonding pad is fixed on the bottom surface of the shell; the metal bonding pads are connected with the chips the chips are connected withthe chips, and the chips are connected with the grounding bonding pad. The assembly has the beneficial effects that the radio frequency front-end transceiver channel is divided into three parts, andcorresponding chip components corresponding to each part are respectively mounted so that the chips related to the transmitting branch and the receiving branch are integrated in one packaging body, and the assembly has the advantages of small size, light weight, high integration level, convenience in array expansion and the like.

Description

technical field [0001] The invention relates to a packaging technology, in particular to an integrated packaging radio frequency microsystem component. Background technique [0002] With the rapid development of system-in-package technology and RF microsystem technology, RF front-end components in the radar and communication fields are increasingly developing in the direction of miniaturization, high integration, and lightweight. RF front-end components are an essential part of modern radar and communications equipment. The RF front-end array has a large number of channels and units, ranging from hundreds to nearly a million channels. Each transceiver channel of the RF front-end includes multiple chips such as transmitting amplification, receiving amplification, amplitude-phase multi-function, power modulation, etc. Therefore, the highly integrated design and packaging of RF front-end components can reduce the size and weight of the entire RF front-end array. It is very im...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/16H01L25/18H01L23/31
CPCH01L23/3107H01L25/162H01L25/165H01L25/18
Inventor 曾鸿江陈兴国杨凝
Owner CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST