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Heat dissipation sheet and device provided with heat dissipation sheet
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A technology for heat sinks and devices, which is applied in electric solid state devices, semiconductor devices, semiconductor/solid state device components, etc., can solve problems such as device failures, and achieve excellent heat dissipation.
Active Publication Date: 2020-04-21
FUJIFILM CORP
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Embodiment 1
[0116]
[0117] 24 g of SGPS (boronnitride, average particle size: 12 μm, manufactured by Denka Company Limited) was classified using a metal mesh with a pore size of 100 μm, and inorganic particles A with a particle size of 100 μm or less and inorganic particles B with a particle size of more than 100 μm were recovered.
[0118]
[0119] 7.2 g of the inorganic particles A and 16.8 g of the inorganic particles B were added to 14.4 g of the resin binder prepared by the same method as in Comparative Example 1, and kneaded to prepare a resin composition.
[0120]
[0121] The prepared resin composition 1 was coated on a copper foil film (C1020, thickness: 100 μm, manufactured by NISHIDA KINZOKU Co., Ltd.) with an applicator so that the dry thickness became 300 μm, and dried under warm air at 130°C After 5 minutes, the coating film was formed, and then it was cured on the condition of 180 degreeC and 1 hour, and the cured film was formed, and the heat radiation sheet with a ...
Embodiment 2
[0123] Resin composition B was coated on the release surface of a polyester film (NP-100A, film thickness 100 μm, manufactured by PANAC CO., LTD.), and a tape polymer was produced in the same manner as in Example 1. Ester film heat sink.
Embodiment 3
[0125] In addition to using a resin composition prepared by adding 2.4 g of inorganic particles A and 21.6 g of inorganic particles B to 14.4 g of the resin binder prepared by the same method as Comparative Example 1, and kneading them, The same method as in Example 2 produced a heat sink with a polyester film.
[0126] The contents of the inorganic particles A and the inorganic particles B were measured for each heat sink produced by the method described above. The results are shown in Table 1 below.
[0127] 〔Heat dissipation〕
[0128] Regarding the evaluation of heat dissipation, after peeling off the copper foil film or the polyester film, the thermal conductivity was measured by the following method, and the evaluation was performed based on the following criteria. The results are shown in Table 1 below.
[0129]
[0130] (1) Using "ai-Phase Mobile 1u" manufactured by ai-Phase Co., Ltd., the thermal diffusivity in the thickness direction of each heat sink was measure...
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Abstract
The present invention addresses the problem of providing: a heat dissipation sheet having exceptional heat dissipation properties; and a device provided with a heat dissipation sheet, in which said heat dissipation sheet is used. This heat dissipation sheet contains a resin binder and inorganic particles, wherein: the inorganic particles contain inorganic particles A having a grain diameter of 100[mu]m or less, and inorganic particles B having a grain diameter exceeding 100 [mu]m; the inorganic particle A content is 10-30% by mass with respect to the total mass of the inorganic particles A and the inorganic particles B; and the inorganic particle B content is 70-90% by mass with respect to the total mass of the inorganic particles A and the inorganic particles B.
Description
technical field [0001] The invention relates to a cooling fin and a device with the cooling fin. Background technique [0002] In recent years, along with miniaturization, higher density, and higher output of electronic devices and semiconductors, high integration of components constituting electronic devices and semiconductors has been progressing. In a highly integrated device (device), various components are arranged without gaps in a limited space, so it is difficult to dissipate heat generated inside the device, and the device itself sometimes reaches a relatively high temperature. In particular, it is known that semiconductor elements such as CPU (Central Processing Unit: central processing unit) and power devices; LED (Light Emitting Diode: light emitting diode) backlight; If heat is accumulated inside the device, problems such as failure of the device due to the heat may occur. [0003] As a method of dissipating the heat inside the device, a method of using a heat...
Claims
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